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1. (WO2013163125) METHOD FOR CREATING ASPERITIES IN METAL FOR METAL-TO-METAL BONDING
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/163125 International Application No.: PCT/US2013/037707
Publication Date: 31.10.2013 International Filing Date: 23.04.2013
IPC:
B81C 1/00 (2006.01) ,H01L 23/10 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
81
MICRO-STRUCTURAL TECHNOLOGY
C
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS
1
Manufacture or treatment of devices or systems in or on a substrate
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
10
characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
Applicants:
ANALOG DEVICES, INC. [US/US]; One Technology Way Norwood, MA 02062-9106, US
Inventors:
TSAU, Christine, H.; US
Agent:
KLAYMAN, Jeffrey, T.; Sunstein Kann Murphy & Timbers LLP 125 Summer Street Boston, MA 02110-1618, US
Priority Data:
13/783,49104.03.2013US
61/639,15527.04.2012US
Title (EN) METHOD FOR CREATING ASPERITIES IN METAL FOR METAL-TO-METAL BONDING
(FR) PROCÉDÉ DE CRÉATION D'ASPÉRITÉS DANS DU MÉTAL POUR UNE LIAISON MÉTAL-MÉTAL
Abstract:
(EN) A first metal such as germanium is prepared for metal-to-metal bonding by depositing the first metal onto a roughened foundation layer so that asperities are present on the first metal layer substantially following the topology of the asperities on the surface of the foundation layer without having to process the surface of the first metal layer. Such asperities can break through barrier layer(s) on the surface of another metal (e.g., an oxide layer, an anti-stiction coating, and/or other barrier layer) during a bonding process so that direct metal-to-metal bonding can be accomplished without having to remove the barrier layer(s) and without having to process the surface of the first metal such as by photolithography or depositing and subsequently removing a material that partially interdiffuses with the first metal.
(FR) Un premier métal tel que du germanium est préparé en vue d'une liaison métal-métal par le dépôt du premier métal sur une couche de base rendue rugueuse de sorte que des aspérités soient présentes sur la première couche métallique suivant sensiblement la topologie des aspérités sur la surface de la couche de base sans avoir à traiter la surface de la première couche métallique. De telles aspérités peuvent percer une(des) couche(s) barrière(s) sur la surface d'un autre métal (par exemple, une couche d'oxyde, un revêtement anti-frottement et/ou une autre couche barrière) pendant un processus de liaison de sorte qu'une liaison métal-métal directe puisse être réalisée sans avoir à retirer la(les) couche(s) barrière(s) et sans avoir à traiter la surface du premier métal par photolithographie ou par dépôt, par exemple, et retirer ensuite un matériau qui se diffuse partiellement avec le premier métal.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)