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1. (WO2013162950) METHODS AND APPARATUS FOR PRE-CHEMICAL MECHANICAL PLANARIZATION OF BUFFING MODULE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2013/162950    International Application No.:    PCT/US2013/036764
Publication Date: 31.10.2013 International Filing Date: 16.04.2013
IPC:
H01L 21/304 (2006.01), B24B 37/04 (2012.01)
Applicants: APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue Santa Clara, California 95054 (US)
Inventors: CHEN, Hui; (US).
CHEN, Hung; (US).
ATKINSON, Jim; (US).
D'AMBRA, Allen L.; (US)
Agent: DUGAN, Brian M.; Dugan & Dugan, PC 245 Saw Mill River Road, Suite 309 Hawthorne, New York 10532 (US)
Priority Data:
13/459,177 28.04.2012 US
Title (EN) METHODS AND APPARATUS FOR PRE-CHEMICAL MECHANICAL PLANARIZATION OF BUFFING MODULE
(FR) PROCÉDÉS ET APPAREIL DE PLANARISATION PRÉ-CHIMICOMÉCANIQUE SUR UN MODULE DE POLISSAGE
Abstract: front page image
(EN)The present invention provides methods and apparatus for a pre-CMP semiconductor substrate buffing module. The invention includes a polishing pad assembly adapted to be rotated against a major surface of a substrate; a chuck adapted to hold the substrate and to rotate the substrate against the polishing pad assembly as the polishing pad assembly is rotated; and a lateral motion motor adapted to oscillate the polishing pad assembly laterally across the major surface of the substrate while the polishing pad assembly is rotated against the rotating substrate. Numerous additional features are disclosed.
(FR)La présente invention concerne des procédés et un appareil pour un module de polissage de substrat semiconducteur avant planarisation chimicomécanique (CMP). L'invention comprend un ensemble tampon de polissage conçu pour tourner contre une surface principale du substrat; un mandrin conçu pour maintenir le substrat et faire tourner le substrat contre l'ensemble tampon de polissage tandis que l'ensemble tampon de polissage est mis en rotation; et un moteur de déplacement latéral conçu pour faire osciller l'ensemble tampon de polissage latéralement sur la surface principale du substrat tandis que l'ensemble tampon de polissage tourne contre le substrat en rotation. L'invention concerne en outre de nombreux aspects additionnels.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)