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1. (WO2013162938) ESC COOLING BASE FOR LARGE DIAMETER SUBSTRATES

Pub. No.:    WO/2013/162938    International Application No.:    PCT/US2013/036659
Publication Date: Fri Nov 01 00:59:59 CET 2013 International Filing Date: Tue Apr 16 01:59:59 CEST 2013
IPC: H01L 21/683
H01L 21/3065
Applicants: APPLIED MATERIALS, INC.
Inventors: TAVASSOLI, Hamid
BERA, Kallol
BUCHBERGER, Douglas
CARDUCCI, James C.
RAUF, Shahid
COLLINS, Kenneth
Title: ESC COOLING BASE FOR LARGE DIAMETER SUBSTRATES
Abstract:
Embodiments include a base for an electrostatic chuck (ESC) assembly for supporting a workpiece during a manufacturing operation in a processing chamber, such as a plasma etch, clean, deposition system, or the like. Inner and outer fluid conduits are disposed in the base to conduct a heat transfer fluid. In embodiments, a counter-flow conduit configuration provides improved temperature uniformity. The conduit segments in each zone are interlaced so that fluid flows are in opposite directions in radially adjacent segments. In embodiments, each separate fluid conduit formed in the base comprises a channel formed in the base with a cap e-beam welded to a recessed lip of the channel to make a sealed conduit. To further improve the thermal uniformity, a compact, tri-fold channel segment is employed in each of the outer fluid loops. In further embodiments, the base includes a multi-contact fitting RF and DC connection, and thermal breaks.