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1. (WO2013162717) GAS DISTRIBUTION MODULE FOR INSERTION IN LATERAL FLOW CHAMBERS
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/162717 International Application No.: PCT/US2013/029642
Publication Date: 31.10.2013 International Filing Date: 07.03.2013
IPC:
H01L 21/205 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
20
Deposition of semiconductor materials on a substrate, e.g. epitaxial growth
205
using reduction or decomposition of a gaseous compound yielding a solid condensate, i.e. chemical deposition
Applicants: RANISH, Joseph M.[US/US]; US (US)
SAMIR, Mehmet Tugrul[US/US]; US (US)
APPLIED MATERIALS, INC.[US/US]; 3050 Bowers Avenue Santa Clara, CA 95054, US (AllExceptUS)
Inventors: RANISH, Joseph M.; US
SAMIR, Mehmet Tugrul; US
Agent: PATTERSON, Todd B.; Patterson & Sheridan, LLP 24 Greenway Plaza, Suite 1600 Houston, TX 77046, US
Priority Data:
61/638,00525.04.2012US
61/662,15420.06.2012US
Title (EN) GAS DISTRIBUTION MODULE FOR INSERTION IN LATERAL FLOW CHAMBERS
(FR) MODULE DE DISTRIBUTION DE GAZ POUR INSERTION DANS DES CHAMBRES À FLUX LATÉRAL
Abstract:
(EN) Embodiments of the invention generally relate to apparatus for and methods of depositing material on a substrate. The apparatus generally include a process chamber having a process gas region therein. Process gas is introduced into the process gas region through a process gas inlet. The chamber also includes lamps positioned outside the chamber to thermally decompose the process gas onto the substrate surface. The process chamber also includes at least one movable gas diffuser adapted to provide process gas to the surface of the substrate to effect a uniform deposition of material on the substrate surface. The methods generally include flowing a process gas parallel to a surface of a substrate, and thermally decomposing the process gas on the substrate. Additional process gas is provided through a movable gas diffuser to the surface of the substrate in a predetermined distribution to effect a uniform deposition on the substrate surface.
(FR) Des modes de réalisation de la présente invention se rapportent de manière générale à un appareil et à des procédés permettant de déposer un matériau sur un substrat. L'appareil comprend de manière générale une chambre de traitement ayant en son sein une région de gaz de traitement. Le gaz de traitement est introduit dans la région de gaz de traitement par l'intermédiaire d'un orifice d'admission de gaz de traitement. La chambre comprend également des lampes positionnées à l'extérieur de la chambre afin de décomposer thermiquement le gaz de traitement sur la surface du substrat. La chambre de traitement comprend également au moins un diffuseur de gaz mobile conçu pour fournir le gaz de traitement à la surface du substrat afin d'effectuer un dépôt uniforme de matériau sur la surface du substrat. Les procédés comprennent de manière générale l'écoulement d'un gaz de traitement parallèlement à une surface d'un substrat, et la décomposition thermique du gaz de traitement sur le substrat. D'autres gaz de traitement sont fournis par l'intermédiaire d'un diffuseur de gaz mobile à la surface du substrat selon une répartition prédéterminée afin d'effectuer un dépôt uniforme sur la surface du substrat.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)