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Machine translation
1. (WO2013162285) CARRIER PLATE FOR FORMING EXTERNAL ELECTRODE AND METHOD FOR MANUFACTURING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2013/162285    International Application No.:    PCT/KR2013/003515
Publication Date: 31.10.2013 International Filing Date: 24.04.2013
IPC:
H01G 13/00 (2013.01), H01C 17/00 (2006.01)
Applicants: GTEC [KR/KR]; #701, Shinil IT Uto, 2-3, Dangjeong-dong, Gunpo-si, Gyeonggi-do 435-030 (KR)
Inventors: NOH, Chan Young; (KR).
KIM, Hak Seung; (KR)
Agent: LEEON INTELLECTUAL PROPERTY LAW FIRM; #903, G+Kolon Digital Tower, 123, Digital-ro 26-gil, Guro-gu, Seoul 152-050 (KR)
Priority Data:
10-2012-0043225 25.04.2012 KR
10-2012-0050028 11.05.2012 KR
10-2012-0112962 11.10.2012 KR
Title (EN) CARRIER PLATE FOR FORMING EXTERNAL ELECTRODE AND METHOD FOR MANUFACTURING SAME
(FR) PLAQUE SUPPORT POUR LA FORMATION D'UNE ÉLECTRODE EXTÉRIEURE ET SON PROCÉDÉ DE FABRICATION
(KO) 외부전극형성용 캐리어 플레이트 및 제조방법
Abstract: front page image
(EN)The invention relates to a carrier plate on which a plurality of chip components are to be fixed so as to form external electrodes on the outer surfaces of chip components, comprising: a first metal plate having a plurality of first holes penetrating therethrough; a second metal plate having a plurality of second holes penetrating therethrough which correspond to the first holes; and a rubber plate interposed between the first metal plate and the second metal plate, the rubber plate being inserted into the first and second holes, respectively, so as to form support holes inside the first and second holes, the inner diameters of the support holes being smaller than the inner diameters of the first and second holes and enabling the outer and inner surfaces of the chip components to contact and be fixed in the support holes.
(FR)Cette invention concerne une plaque support conçue pour le montage d'une pluralité de composants de puce de façon à former des électrodes externes sur les surfaces extérieures des composants de puce, comprenant : une première plaque métallique présentant une pluralité de premiers orifices traversants; une seconde plaque métallique présentant une pluralité de seconds orifices traversants, correspondant aux premiers orifices; et une plaque de caoutchouc interposée entre la première plaque métallique et la seconde plaque métallique, la plaque de caoutchouc étant insérée dans les premiers et les seconds orifices, respectivement, de façon à former des orifices de support à l'intérieur des premiers et seconds orifices, les diamètres intérieurs des orifices de support étant inférieurs aux diamètres intérieurs des premiers et des seconds orifices et permettant aux surfaces extérieures et intérieures des composants de puce d'entrer en contact avec les orifices de support et d'être fixés dans ceux-ci.
(KO)본 발명은 외부 면에 외부전극을 형성하도록 복수 개의 칩 부품이 고정되는 캐리어 플레이트에 있어서, 복수개의 제1개구홀을 관통형성한 제1금속판;상기 제1개구홀과 대응하는 복수개의 제2개구홀을 관통형성한 제2금속판 : 상기 제1금속판과 제2금속판사이에 개재되고, 상기 제1,2개구홀에 각각 충진되면서 상기 제1,2개구홀 내부에 상기 제1,2개구홀의 내경보다 작은 크기의 내경을 갖추어 상기 칩부품의 외부면과 내주면이 접하여 삽입고정되는 지지홀을 형성하는 러버판;을 포함한다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)