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1. (WO2013162004) ELECTRONIC DEVICE MANUFACTURING APPARATUS
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/162004 International Application No.: PCT/JP2013/062413
Publication Date: 31.10.2013 International Filing Date: 26.04.2013
IPC:
H05B 33/10 (2006.01) ,H01L 51/50 (2006.01) ,H05B 33/28 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
10
Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
12
Light sources with substantially two-dimensional radiating surfaces
26
characterised by the composition or arrangement of the conductive material used as an electrode
28
of translucent electrodes
Applicants:
コニカミノルタ株式会社 KONICA MINOLTA, INC. [JP/JP]; 東京都千代田区丸の内二丁目7番2号 2-7-2, Marunouchi, Chiyoda-ku, Tokyo 1007015, JP
Inventors:
木下 敏幸 KINOSHITA Toshiyuki; JP
波木井 健 HAKII Takeshi; JP
石代 宏 ISHIDAI Hiroshi; JP
吉田 和央 YOSHIDA Kazuhiro; JP
小野 美奈子 ONO Minako; JP
辻村 隆俊 TSUJIMURA Takatoshi; JP
Agent:
特許業務法人信友国際特許事務所 SHIN-YU INTERNATIONAL PATENT FIRM; 東京都渋谷区笹塚2-1-6 笹塚センタービル Sasazuka Center Bldg., 2-1-6, Sasazuka, Shibuya-ku, Tokyo 1510073, JP
Priority Data:
2012-10228527.04.2012JP
Title (EN) ELECTRONIC DEVICE MANUFACTURING APPARATUS
(FR) APPAREIL DE FABRICATION DE DISPOSITIF ÉLECTRONIQUE
(JA) 電子デバイスの製造装置
Abstract:
(EN) This electronic device manufacturing apparatus is provided with: a substrate holding member; a first supply source which is provided so as to move relative to the primary surface side of the substrate, and which forms a nitrogen-containing layer by supplying a nitrogen-containing compound towards the primary surface of the substrate; and a second supply source which is disposed downstream of the first supply source in the direction of movement relative to the substrate, which forms a transparent electrode layer by supplying towards the primary surface of the substrate an electrode material having silver as the main component thereof, and which is disposed such that, between starting formation and two minutes after finishing formation of the nitrogen-containing layer at a prescribed position on the substrate, formation of the transparent electrode layer is started at said prescribed position on the substrate.
(FR) Le présent appareil de fabrication de dispositif électronique comporte : un organe de support de substrat ; une première source d'alimentation qui est relativement déplacée vers le côté de la surface primaire du substrat et qui dépose une couche contenant de l'azote en apportant un composé contenant de l'azote vers la surface primaire du substrat ; et une seconde source d'alimentation qui est disposée en aval de la première source d'alimentation dans le sens de déplacement relatif du substrat, laquelle dépose une couche d'électrode transparente en apportant vers la surface primaire du substrat un matériau d'électrode dont l'argent est le composant principal, et qui est déposée de telle sorte que, entre le début du dépôt et deux minutes après avoir fini le dépôt de la couche contenant de l'azote à une position prédéfinie sur le substrat, le dépôt de la couche d'électrode transparente est commencé à ladite position prédéfinie sur le substrat.
(JA)  基材の保持部材と、基材の一主面側に相対的に移動して設けられ当該基材の一主面に向かって窒素含有化合物を供給して窒素含有層を成膜するための第1供給源と、第1供給源よりも基材の相対的な移動方向の下流側に設けられ、当該基材の一主面に向かって銀を主成分とする電極材料を供給して透明電極層を成膜するためのもので、当該基材の所定位置に対しての窒素含有層の成膜開始後から成膜終了後2分までの間に、当該所定位置に対して透明電極層の成膜が開始されるように設けられた第2供給源とを備えた電子デバイスの製造装置。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)