Search International and National Patent Collections
|1. (WO2013161912) DEFECT INSPECTION DEVICE AND DEFECT INSPECTION METHOD|
|Applicants:||HITACHI HIGH-TECHNOLOGIES CORPORATION
|Title:||DEFECT INSPECTION DEVICE AND DEFECT INSPECTION METHOD|
To detect an infinitesimal defect, highly precisely measure the dimensions of the detected defect, non-destructively inspect a sample, allow obtaining a substantially constant inspection result relating to the quantity, locations, dimensions, and types of the detected defects, and allow inspecting multiple samples within a constant time, a defect inspection device is configured to comprise: a projection means for projecting an illumination light in a linear region in a surface of a sample; a detection means for detecting a reflected/scattered light from the linear region whereupon the light is projected upon the sample by the projection means; and a signal processing means for processing a signal which is obtained by detecting the reflected/scattered light and detecting a defect upon the sample. The detection means further comprises: an optical assembly which diffuses the reflected/scattered light from the sample in one direction and forms an image in a direction which is orthogonal to the one direction; and a detection assembly having an array sensor in which detection pixels are positioned two-dimensionally, which detects the reflected/scattered light which is diffused in the one direction and image formed in the direction which is orthogonal to the one direction by the optical assembly, adds output signals of each of the detection pixels which are aligned in the direction in which the reflected/scattered light is diffused, and outputs same.