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1. (WO2013161878) COMPONENT MOUNTING DEVICE

Pub. No.:    WO/2013/161878    International Application No.:    PCT/JP2013/062078
Publication Date: Fri Nov 01 00:59:59 CET 2013 International Filing Date: Thu Apr 25 01:59:59 CEST 2013
IPC: H05K 13/04
H05K 13/08
Applicants: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
株式会社日立ハイテクインスツルメンツ
Inventors: TAKAHIRA Isao
高平 功
SAEGUSA Takashi
三枝 高志
INOUE Tomohiro
井上 智博
Title: COMPONENT MOUNTING DEVICE
Abstract:
In the related art, a mounting error of a component mounting device was what was allowed by a required mounting accuracy. However, in the present invention, it has been found that the required mounting accuracy increases significantly as high-density mounting is required later for a component mounting device. In other words, it has been found that the required mounting accuracy increases to the point that the mounting error, which has been allowed to date, is no longer allowable. The present invention purports to resolve the above-described problem by obtaining an image including at least one of a position where a component is to be mounted on a substrate and a tip of a nozzle shaft, and performing component mounting.