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1. (WO2013161861) PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING CURED FILM, CURED FILM, ORGANIC EL DISPLAY DEVICE, AND LIQUID-CRYSTAL DISPLAY DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/161861 International Application No.: PCT/JP2013/062026
Publication Date: 31.10.2013 International Filing Date: 24.04.2013
IPC:
G03F 7/004 (2006.01) ,C08G 18/62 (2006.01) ,C08G 18/80 (2006.01) ,G03F 7/039 (2006.01) ,G03F 7/40 (2006.01) ,H01L 21/027 (2006.01) ,H01L 51/50 (2006.01) ,H05B 33/22 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
18
Polymeric products of isocyanates or isothiocyanates
06
with compounds having active hydrogen
28
characterised by the compounds used containing active hydrogen
40
High-molecular-weight compounds
62
Polymers of compounds having carbon-to-carbon double bonds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
18
Polymeric products of isocyanates or isothiocyanates
06
with compounds having active hydrogen
70
characterised by the isocyanates or isothiocyanates used
72
Polyisocyanates or polyisothiocyanates
80
Masked polyisocyanates
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
039
Macromolecular compounds which are photodegradable, e.g. positive electron resists
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
26
Processing photosensitive materials; Apparatus therefor
40
Treatment after imagewise removal, e.g. baking
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
027
Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
12
Light sources with substantially two-dimensional radiating surfaces
22
characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
Applicants: FUJIFILM CORPORATION[JP/JP]; 26-30, Nishiazabu 2-chome, Minato-ku, Tokyo 1068620, JP
Inventors: SHIMOYAMA Tatsuya; JP
YAMAZAKI Kenta; JP
HIKITA Masanori; JP
Agent: SIKS & CO.; 8th Floor, Kyobashi-Nisshoku Bldg., 8-7, Kyobashi 1-chome, Chuo-ku, Tokyo 1040031, JP
Priority Data:
2012-10400127.04.2012JP
Title (EN) PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING CURED FILM, CURED FILM, ORGANIC EL DISPLAY DEVICE, AND LIQUID-CRYSTAL DISPLAY DEVICE
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE, PROCÉDÉ DE FORMATION D'UN FILM DURCI, FILM DURCI, DISPOSITIF D'AFFICHAGE EL ORGANIQUE ET DISPOSITIF D'AFFICHAGE À CRISTAUX LIQUIDES
(JA) 感光性樹脂組成物、硬化膜の形成方法、硬化膜、有機EL表示装置、および、液晶表示装置
Abstract:
(EN) Provided is a photosensitive resin composition having high sensitivity, high transparency, high chemical resistance, high adhesion with a curing-film substrate, and exceptional dry-etching resistance, and enabling a low-permittivity curing film to be obtained. A photosensitive resin composition containing: (A) a polymer component including a polymer fulfilling at least one of (1) and (2): (1) a polymer having (a1) a structural unit in which an acid group has a residue protected by an acidolytic group, and (a2) a structural unit having a cross-linking group; (2) (a1) a polymer having a structural unit in which an acid group has a residue protected by an acidolytic group, and (a2) a polymer having a structural unit having a cross-linking group; (B) a photo-acid-generating agent; (C) an adduct-type block polyisocyanate compound; and (D) a solvent.
(FR) L'invention concerne une composition de résine photosensible ayant une haute sensibilité, une haute transparence, une haute résistance chimique, une haute adhérence avec un substrat de film durcissant, et une résistance exceptionnelle à la gravure sèche, et permettant l'obtention d'un film durcissant de faible permittivité. L'invention concerne également une composition de résine photosensible contenant : (A) un composant polymère comprenant un polymère respectant au moins l'un de (1) et (2) : (1) un polymère ayant (a1) un motif structurel dans lequel un groupe acide a un résidu protégé par un groupe acidolytique ; et (a2) un motif structurel ayant un groupe de réticulation ; (2) (a1) un polymère ayant un motif structurel dans lequel un groupe acide a un résidu protégé par un groupe acidolytique ; et (a2) un polymère ayant un motif structurel ayant un groupe de réticulation ; (B) un agent générant un photoacide ; (C) un composé isocyanate séquencé de type produit d'addition ; et (D) un solvant.
(JA)  感度が高く、透明性が高く、耐薬品性が高く、硬化膜の基板との密着性が高く、ドライエッチング耐性に優れ、誘電率が低い硬化膜を得ることができる感光性樹脂組成物の提供。 (A)下記(1)および(2)の少なくとも一方を満たす重合体を含む重合体成分、 (1)(a1)酸基が酸分解性基で保護された残基を有する構成単位、および(a2)架橋性基を有する構成単位、を有する重合体、 (2)(a1)酸基が酸分解性基で保護された残基を有する構成単位を有する重合体、および(a2)架橋性基を有する構成単位を有する重合体、 (B)光酸発生剤、 (C)アダクト型ブロックポリイソシアネート化合物、および、(D)溶剤、を含む感光性樹脂組成物。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)