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1. (WO2013161849) DICING BLADE

Pub. No.:    WO/2013/161849    International Application No.:    PCT/JP2013/061998
Publication Date: Fri Nov 01 00:59:59 CET 2013 International Filing Date: Thu Apr 25 01:59:59 CEST 2013
IPC: H01L 21/301
B24D 3/00
B24D 5/00
B24D 5/12
Applicants: TOKYO SEIMITSU CO., LTD.
株式会社東京精密
SHIN-NIHON TECH INC.
株式会社 新日本テック
WATANABE, Junji
渡邉 純二
Inventors: WATANABE, Junji
渡邉 純二
FUJITA, Takashi
藤田 隆
IZUMI, Yasuo
和泉 康夫
Title: DICING BLADE
Abstract:
Provided is a dicing blade with which cutting work can be performed stably and precisely in a ductile mode on a workpiece formed of a brittle material, without generating cracks or breaking. This dicing blade (26), which performs cutting work on a workpiece, is formed integrally in the shape of a disk by means of a diamond sintered body (80) formed by sintering diamond abrasive grains (82). The content of the diamond abrasive gains (82) in the diamond sintered body (80) is at least 80% by volume. Preferably, recessed parts formed in the surface of the diamond sintered body (80) are provided continuously in the circumferential direction at the outer circumferential part of the dicing blade (26).