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|1. (WO2013161695) PACKAGE FOR HOUSING ELECTRONIC COMPONENT AND ELECTRONIC DEVICE|
|Title:||PACKAGE FOR HOUSING ELECTRONIC COMPONENT AND ELECTRONIC DEVICE|
[Problem] To provide a package for housing an electronic component in which there is used a frame body created by folding a strip plate, wherein deformation or the like occurring in the bonding part of the frame body due to heat expansion is minimized, the bonding performance is excellent, and the electronic component can be correctly and stably operated over a long period; and to provide an electronic device. [Solution] A package for housing an electronic component, provided with a base body (1) having on the upper-side principal surface a placement part (1a) for placing an electronic component, and a frame body (2) bonded to the base body (1) so as to surround the placement part (1a). The frame body (2) is obtained by folding a single strip plate at a plurality of locations, and causing a protrusion part (2c), which has a greater width at the tip than at the base (2d), provided on one end (2a), to engage and bond with an engaging part (2e), corresponding to the protrusion part (2c), provided on the other end (2b). It is possible to obtain a package for housing an electronic component in which the bonding part has excellent bonding performance.