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1. (WO2013161695) PACKAGE FOR HOUSING ELECTRONIC COMPONENT AND ELECTRONIC DEVICE

Pub. No.:    WO/2013/161695    International Application No.:    PCT/JP2013/061608
Publication Date: Fri Nov 01 00:59:59 CET 2013 International Filing Date: Sat Apr 20 01:59:59 CEST 2013
IPC: H01L 23/04
H01L 23/06
Applicants: KYOCERA CORPORATION
京セラ株式会社
Inventors: UCHIDA, Takeo
内田 剛生
KUSHIMA, Hikaru
久島 洸
ASANO, Toshimitsu
浅野 稔弘
YAMAOKA, Masahiro
山岡 壮大
Title: PACKAGE FOR HOUSING ELECTRONIC COMPONENT AND ELECTRONIC DEVICE
Abstract:
[Problem] To provide a package for housing an electronic component in which there is used a frame body created by folding a strip plate, wherein deformation or the like occurring in the bonding part of the frame body due to heat expansion is minimized, the bonding performance is excellent, and the electronic component can be correctly and stably operated over a long period; and to provide an electronic device. [Solution] A package for housing an electronic component, provided with a base body (1) having on the upper-side principal surface a placement part (1a) for placing an electronic component, and a frame body (2) bonded to the base body (1) so as to surround the placement part (1a). The frame body (2) is obtained by folding a single strip plate at a plurality of locations, and causing a protrusion part (2c), which has a greater width at the tip than at the base (2d), provided on one end (2a), to engage and bond with an engaging part (2e), corresponding to the protrusion part (2c), provided on the other end (2b). It is possible to obtain a package for housing an electronic component in which the bonding part has excellent bonding performance.