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1. (WO2013161660) PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE

Pub. No.:    WO/2013/161660    International Application No.:    PCT/JP2013/061473
Publication Date: Fri Nov 01 00:59:59 CET 2013 International Filing Date: Fri Apr 19 01:59:59 CEST 2013
IPC: H01L 23/04
H01L 23/08
H01R 13/66
H01R 33/76
Applicants: KYOCERA CORPORATION
京セラ株式会社
Inventors: TSUJINO, Mahiro
辻野 真広
Title: PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE
Abstract:
A package (3) for housing a semiconductor element, the package (3) for housing a semiconductor element being provided with: a substrate (31) having on the upper surface a mounting region (R) for mounting a semiconductor element (2); a wiring conductor (32) formed on the substrate (31) from the mounting region (R) to the edge part of the substrate (31); a frame body (33) provided on the substrate (31) so as to surround the mounting region (R) and so that the edge part of the substrate (31) is exposed to the outer side of the frame body (33); and a connector member (34) provided on a side surface of the substrate (31) at a distance from the frame body (33) and electrically connected to the wiring conductor (32).