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1. (WO2013161601) RESIN ENCODER SCALE, MOLD FOR RESIN ENCODER SCALE, MANUFACTURING METHOD FOR RESIN ENCODER SCALE, AND ENCODER

Pub. No.:    WO/2013/161601    International Application No.:    PCT/JP2013/061163
Publication Date: Fri Nov 01 00:59:59 CET 2013 International Filing Date: Tue Apr 16 01:59:59 CEST 2013
IPC: G01D 5/347
Applicants: HITACHI MAXELL, LTD.
日立マクセル株式会社
NIKON CORPORATION
株式会社ニコン
Inventors: SUZUISHI, Mitsunobu
鈴石 光信
SHIBUYA, Masataka
渋谷 雅貴
TOKAIRIN, Hiroshi
東海林 宏
Title: RESIN ENCODER SCALE, MOLD FOR RESIN ENCODER SCALE, MANUFACTURING METHOD FOR RESIN ENCODER SCALE, AND ENCODER
Abstract:
The purpose of the present invention is to provide a resin encoder scale enabling processing to be made simple and costs to be reduced by manufacturing the encoder scale as a resin molded article having a gradation pattern. A resin encoder scale (1) can be used by an encoder of a reflective-type optical system, and is provided with a gradation pattern (2) for position measurement. The gradation pattern (2) is configured so that the following are disposed alternately and repeatedly: low reflectance sections (3) having low light reflectivity and the surfaces of which are formed when resin molding to be rough; and high reflectance sections (4) having higher light reflectivity than the low reflectance sections (3) and the surfaces of which are formed when resin molding to be specular.