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1. (WO2013161454) METHOD FOR PRODUCING MOLD FOR TRANSFERRING FINE PATTERN, METHOD FOR PRODUCING SUBSTRATE HAVING UNEVEN STRUCTURE USING SAME, AND METHOD FOR PRODUCING ORGANIC EL ELEMENT HAVING SAID SUBSTRATE HAVING UNEVEN STRUCTURE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/161454 International Application No.: PCT/JP2013/057851
Publication Date: 31.10.2013 International Filing Date: 19.03.2013
IPC:
B29C 59/02 (2006.01) ,B29C 33/38 (2006.01) ,H01L 21/027 (2006.01) ,H01L 51/50 (2006.01) ,H05B 33/02 (2006.01) ,H05B 33/10 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
59
Surface shaping, e.g. embossing; Apparatus therefor
02
by mechanical means, e.g. pressing
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
33
Moulds or cores; Details thereof or accessories therefor
38
characterised by the material or the manufacturing process
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
027
Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
10
Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
Applicants:
JX日鉱日石エネルギー株式会社 JX NIPPON OIL & ENERGY CORPORATION [JP/JP]; 東京都千代田区大手町二丁目6番3号 6-3, Otemachi 2-chome, Chiyoda-ku, Tokyo 1008162, JP
Inventors:
關 隆史 SEKI, Takashi; JP
増山 聡 MASUYAMA, Satoshi; JP
福田 真林 FUKUDA, Maki; JP
西村 涼 NISHIMURA, Suzushi; JP
Agent:
川北 喜十郎 KAWAKITA, Kijuro; 東京都新宿区新宿一丁目5番4号 YKBマイクガーデン YKB Mike Garden, 5-4, Shinjuku 1-chome, Shinjuku-ku, Tokyo 1600022, JP
Priority Data:
2012-10106526.04.2012JP
Title (EN) METHOD FOR PRODUCING MOLD FOR TRANSFERRING FINE PATTERN, METHOD FOR PRODUCING SUBSTRATE HAVING UNEVEN STRUCTURE USING SAME, AND METHOD FOR PRODUCING ORGANIC EL ELEMENT HAVING SAID SUBSTRATE HAVING UNEVEN STRUCTURE
(FR) PROCÉDÉ DE PRODUCTION D'UN MOULE POUR TRANSFÉRER UNE STRUCTURE FINE, PROCÉDÉ DE PRODUCTION D'UN SUBSTRAT PRÉSENTANT UNE STRUCTURE IRRÉGULIÈRE EN UTILISANT CELUI-CI ET PROCÉDÉ DE PRODUCTION D'UN ÉLÉMENT ORGANIQUE PRÉSENTANT LEDIT SUBSTRAT PRÉSENTANT UNE STRUCTURE IRRÉGULIÈRE
(JA) 微細パターン転写用のモールドの製造方法及びそれを用いた凹凸構造を有する基板の製造方法、並びに該凹凸構造を有する基板を有する有機EL素子の製造方法
Abstract:
(EN) Provided, by a simple process and with high throughput, is a mold for transferring a fine pattern, suitable for producing a substrate having an uneven structure such as a diffraction grating. A method for producing a mold for transferring a fine pattern, comprising a step for coating the surface of a base material with a solution comprising a block copolymer and a polyalkylene oxide, a solvent phase separation step for phase-separating the block copolymer in the presence of an organic solvent vapor to obtain a block copolymer film which has an uneven structure on the surface and the interior of which is a horizontal cylinder structure, a step for layering a metal layer by electroforming, and a step for peeling off the base material having the uneven structure from the metal layer.
(FR) Un procédé simple et doté d'un haut débit permet de fabriquer un moule pour le transfert d'une structure fine et est conçu pour produire un substrat présentant une structure irrégulière telle qu'un réseau de diffraction. La présente invention concerne un procédé de production d'un moule pour transférer une structure fine comprenant une étape consistant à revêtir la surface d'un matériau de base avec une solution comprenant un copolymère bloc et un oxyde de polyalkylène, une étape de séparation de phase de solvant consistant à séparer les phases du copolymère bloc en présence d'une vapeur de solvant organique pour obtenir un film copolymère bloc qui présente une structure irrégulière sur la surface et dont l'intérieur est une structure de cylindre horizontal, une étape consistant à déposer une couche métallique par électroformage et une étape consistant à peler un matériau de base présentant une structure irrégulière sur la couche métallique.
(JA)  回折格子のような凹凸構造を有する基板の製造に好適である微細パターン転写用のモールドを簡易なプロセスで且つ高いスループットで提供する。 微細パターン転写用のモールドの製造方法は、基材の表面にブロック共重合体とポリアルキレンオキシドとを含む溶液を塗布する工程と、ブロック共重合体を有機溶媒蒸気の存在下で相分離させて表面に凹凸構造を有し且つ内部が水平シリンダ構造のブロック共重合体膜を得る溶媒相分離工程と、電鋳により金属層を積層する工程と、前記金属層から凹凸構造を有する基材を剥離する工程とを含む。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)