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1. (WO2013161453) DRIFT PLATE AND JET DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/161453 International Application No.: PCT/JP2013/057832
Publication Date: 31.10.2013 International Filing Date: 19.03.2013
Chapter 2 Demand Filed: 23.01.2014
IPC:
B23K 1/08 (2006.01) ,B23K 3/06 (2006.01) ,H05K 3/34 (2006.01) ,B23K 101/42 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1
Soldering, e.g. brazing, or unsoldering
08
Soldering by means of dipping in molten solder
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
3
Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
06
Solder feeding devices; Solder melting pans
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
101
Articles made by soldering, welding or cutting
36
Electric or electronic devices
42
Printed circuits
Applicants: SENJU METAL INDUSTRY CO., LTD.[JP/JP]; 23, Senju-Hashido-cho, Adachi-ku, Tokyo 1208555, JP
Inventors: NISHIDA Shingo; JP
Agent: YAMAGUCHI INTERNATIONAL PATENT FIRM; Takamura Building 5F, 3-14-7, Yushima, Bunkyo-ku, Tokyo 1130034, JP
Priority Data:
2012-10324927.04.2012JP
Title (EN) DRIFT PLATE AND JET DEVICE
(FR) PLAQUE DE POINÇON ET DISPOSITIF À JET
(JA) 偏流板及び噴流装置
Abstract:
(EN) The present invention comprises: a drift plate on which the structure of a drift member is devised to change the direction of the flow of molten solder; a semi-cylindrical plate (11) that has a predetermined inner shape and a predetermined height as illustrated in Fig. 1 and is erected on a predetermined substrate to change the direction of the flow of the molten solder; and a semi-cylindrical plate (12) that has a predetermined inner shape and a predetermined height and is disposed on the substrate (13) where the semi-cylindrical plate (11) is erected to change the direction of the flow of the molten solder. The semi-cylindrical plate (11) and the semi-cylindrical plate (12) are opposed to each other so that an inner surface of the semi-cylindrical plate (11) faces an end portion of the semi-cylindrical plate (12) and an inner surface of the semi-cylindrical plate (12) faces an end portion of the semi-cylindrical plate (11). According to the structure, the molten solder can be jetted to a target position, and the width direction distribution of the jetted height of the molten solder can be uniform.
(FR) La présente invention concerne : une plaque de poinçon sur laquelle la structure d'un élément de poinçon est conçue pour modifier la direction de l'écoulement de brasure fondue ; une plaque semi-cylindrique (11) qui présente une forme interne prédéterminée et une hauteur prédéterminée telles qu'illustrées sur la figure 1 et est érigée sur un substrat prédéterminé pour modifier la direction de l'écoulement de brasure fondue ; et une plaque semi-cylindrique (12) qui présente une forme interne prédéterminée et une hauteur prédéterminée et est disposée sur le substrat (13) où la plaque semi-cylindrique (11) est érigée pour modifier la direction de l'écoulement de la brasure fondue. La plaque semi-cylindrique (11) et la plaque semi-cylindrique (12) sont opposées l'une à l'autre de sorte qu'une surface interne de la plaque semi-cylindrique (11) est orientée vers une partie extrémité de la plaque semi-cylindrique (12) et une surface interne de la plaque semi-cylindrique (12) est orientée vers une partie extrémité de la plaque semi-cylindrique (11). Selon la structure, la brasure fondue peut être éjectée vers une position cible et la distribution dans le sens de la largeur de la hauteur éjectée de brasure fondue peut être uniforme.
(JA)  溶融はんだの流れの向きを変える偏流部材の構造が工夫された偏流板は、図1に示すように、所定の内面形状を有し、かつ、所定の高さを有して、所定の基板に立設され、溶融はんだの流れの方向を変える半円筒板11と、所定の内面形状を有し、かつ、所定の高さを有して、半円筒板11が立設された基板13に配設され、溶融はんだの流れの方向を変える半円筒板12とを備えている。半円筒板11と半円筒板12とは、当該半円筒板11の内面と半円筒板12の端部が対峙し、かつ、半円筒板12の内面と半円筒板11の端部が対峙するように向かい合わされている。この構造によれば、目標位置に溶融はんだを噴出できるようになると共に、溶融はんだの噴流高さの幅方向分布を均一化できるようになる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)