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1. (WO2013161168) SOLID-STATE IMAGE PICK-UP DEVICE

Pub. No.:    WO/2013/161168    International Application No.:    PCT/JP2013/001749
Publication Date: Fri Nov 01 00:59:59 CET 2013 International Filing Date: Fri Mar 15 00:59:59 CET 2013
IPC: H01L 27/14
H04N 5/369
Applicants: PANASONIC CORPORATION
パナソニック株式会社
Inventors: TANAKA, Keisuke
田中 圭介
SAITOU, Shigeru
齋藤 繁
USUDA, Manabu
薄田 学
ONOZAWA, Kazutoshi
小野澤 和利
Title: SOLID-STATE IMAGE PICK-UP DEVICE
Abstract:
A solid-state image pick-up device (11) is provided with an image pick-up region (12) in which a plurality of image elements (14) are arranged in parallel on a semiconductor substrate (22), and a peripheral circuit region (13). The image elements (14) are provided with the following: a light receiving section (21) formed in the semiconductor substrate (22); a wiring layer (23) formed on the semiconductor substrate (22); and a light collecting element (25) formed on the wiring layer (23). The light collecting element (25) comprises a plurality of circular arc-shaped light transmitting films (26) having as the center thereof an axis perpendicular to the semiconductor substrate (22) and that are divided at the same degree as the wavelength of incident light or at a line width shorter than such degree. In the picture elements (14) positioned in a peripheral section (16) in an image pick-up region (12), from among the plurality of light transmitting films (26) constituting the light collecting element (25), the average height of light transmitting films (26) positioned more toward the central section (15) of the image pick-up region (12) than the axis thereof is higher than the average height of light transmitting films (26) positioned more toward the peripheral section (16) of the image pick-up region (12) than the axis thereof.