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1. (WO2013160454) ELECTRICALLY CONDUCTIVE POLYAMIDE SUBSTRATE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2013/160454    International Application No.:    PCT/EP2013/058749
Publication Date: 31.10.2013 International Filing Date: 26.04.2013
IPC:
C08L 77/00 (2006.01), H01B 1/02 (2006.01), B32B 15/088 (2006.01), H05K 3/12 (2006.01), C09D 11/00 (2006.01)
Applicants: DSM IP ASSETS B.V. [NL/NL]; Het Overloon 1 NL-6411 TE Heerlen (NL)
Inventors: BURGT VAN DER, Frank Peter Theodorus Johannes; (NL).
SCHRÖDER, Christiaan; (NL)
Agent: DEKKER, Henrike Cornelie Christine; DSM Intellectual Property P.O. Box 4 NL-6100 AA Echt (NL)
Priority Data:
12165949.4 27.04.2012 EP
Title (EN) ELECTRICALLY CONDUCTIVE POLYAMIDE SUBSTRATE
(FR) SUBSTRAT EN POLYAMIDE ÉLECTROCONDUCTEUR
Abstract: front page image
(EN)The invention relates to an electrically conductive system comprising a substrate and at least one conductive track adhered onto the substrate, wherein the substrate is composed of at least a polyamide and the conductive track is made out of an electrically conductive material and wherein the conductive track is adhered to the substrate by an jet printing technique followed by sintering. The invention further relates to a process for the production of an electrically conductive system and to its uses.
(FR)L'invention concerne un système électroconducteur comprenant un substrat et au moins une piste conductrice liée au substrat. Le substrat se compose d'au moins un polyamide. La piste conductrice est faite d'un matériau électroconducteur et est liée au substrat par une technique d'impression par projection suivie d'un frittage. L'invention concerne en outre un procédé de production d'un système électroconducteur, ainsi que ses utilisations.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)