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1. (WO2013159307) SEMICONDUCTOR DEVICE INCLUDING ELECTROMAGNETIC ABSORPTION AND SHIELDING

Pub. No.:    WO/2013/159307    International Application No.:    PCT/CN2012/074737
Publication Date: Fri Nov 01 00:59:59 CET 2013 International Filing Date: Fri Apr 27 01:59:59 CEST 2012
IPC: H01L 23/552
H05K 9/00
H05K 1/02
H05K 3/46
H01L 27/02
Applicants: SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD.
SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
HUANG, Dacheng
BAI, Ye
QIAN, Kaiyou
CHIU, Chin-Tien
Inventors: HUANG, Dacheng
BAI, Ye
QIAN, Kaiyou
CHIU, Chin-Tien
Title: SEMICONDUCTOR DEVICE INCLUDING ELECTROMAGNETIC ABSORPTION AND SHIELDING
Abstract:
A semiconductor device is disclosed including material for absorbing EMI and/or RFI The device includes a substrate (202), one or more semiconductor die (224,225), and molding compound around the one or more semiconductor die (224,225). The material for absorbing EMI and/or RFI may be provided within or on a solder mask layer (210) on the substrate (202). The device may further include EMI/RFI-absorbing material around the molding compound and in contact with the EMI/RFI-absorbing material on the substrate to completely enclose the one or more semiconductor die in EMI/RFI-absorbing material.