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1. (WO2013158949) LIGHT EMITTING DIODES AND A METHOD OF PACKAGING THE SAME

Pub. No.:    WO/2013/158949    International Application No.:    PCT/US2013/037288
Publication Date: Fri Oct 25 01:59:59 CEST 2013 International Filing Date: Sat Apr 20 01:59:59 CEST 2013
IPC: H01L 33/48
H01L 33/52
Applicants: RENSSELAER POLYTECHNIC INSTITUTE
Inventors: KARLICEK, Robert, F.
LU, James, Jian-Qiang
GOODWIN, Charles, Sanford
TKACHENKO, Anton
Title: LIGHT EMITTING DIODES AND A METHOD OF PACKAGING THE SAME
Abstract:
Disclosed herein is a method of assembling an array of light emitting diode (LED) dies on a substrate comprising : positioning dies in fluid; exposing the dies to a magnetic force to attract the dies onto magnets that are arranged at pre-determined locations either on or near the substrate; and forming permanent connections between the dies and the substrate thereby constituting an array of LED dies on a substrate.