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1. (WO2013157565) THERMAL ADHESIVE POLYIMIDE FILM, METHOD FOR PRODUCING THERMAL ADHESIVE POLYIMIDE FILM, AND POLYIMIDE/METAL LAMINATE USING THERMAL ADHESIVE POLYIMIDE FILM
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/157565 International Application No.: PCT/JP2013/061356
Publication Date: 24.10.2013 International Filing Date: 17.04.2013
IPC:
B32B 27/34 (2006.01) ,B32B 15/088 (2006.01) ,C08G 73/10 (2006.01) ,C08J 5/18 (2006.01) ,C09J 7/02 (2006.01) ,C09J 179/08 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
34
comprising polyamides
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
088
comprising polyamides
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73
Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06
Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
10
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
18
Manufacture of films or sheets
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7
Adhesives in the form of films or foils
02
on carriers
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
179
Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/-C09J177/263
04
Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Applicants:
宇部興産株式会社 UBE INDUSTRIES, LTD. [JP/JP]; 山口県宇部市大字小串1978番地の96 1978-96, Oazakogushi, Ube-shi, Yamaguchi 7558633, JP
Inventors:
飯泉 暢 IIZUMI Nobu; JP
有原 英雄 ARIHARA Hideo; JP
升井 英治 MASUI Eiji; JP
柳田 圭一 YANAGIDA Keiichi; JP
河内山 拓郎 KOCHIYAMA Takuro; JP
Agent:
松井 茂 MATSUI Shigeru; 東京都中央区銀座八丁目16番5号 銀座中央ビル2階 2nd Floor, Ginza Chuo Bldg., 16-5, Ginza 8-chome, Chuo-ku, Tokyo 1040061, JP
Priority Data:
2012-09560619.04.2012JP
2012-09561319.04.2012JP
2012-28224926.12.2012JP
Title (EN) THERMAL ADHESIVE POLYIMIDE FILM, METHOD FOR PRODUCING THERMAL ADHESIVE POLYIMIDE FILM, AND POLYIMIDE/METAL LAMINATE USING THERMAL ADHESIVE POLYIMIDE FILM
(FR) FILM DE POLYIMIDE THERMOADHÉSIF, MÉTHODE DE PRODUCTION D'UN FILM DE POLYIMIDE THERMOADHÉSIF, ET STRATIFIÉ POLYIMIDE/MÉTAL UTILISANT UN FILM DE POLYIMIDE THERMOADHÉSIF
(JA) 熱融着性ポリイミドフィルム、熱融着性ポリイミドフィルムの製造方法及び熱融着性ポリイミドフィルムを用いたポリイミド金属積層体
Abstract:
(EN) Provided are a thermal adhesive polyimide film that offers excellent heat resistance and excellent adhesiveness to a metal layer, a method for producing the thermal adhesive polyimide film, and a polyimide/metal laminate using the thermal adhesive polyimide film. A multi-layered thermal adhesive polyimide film comprising a thermal adhesive polyimide layer and a heat-resistant polyimide layer layered in contact with the thermal adhesive polyimide layer, the thermal adhesive polyimide film being characterized in that: the thermal adhesive polyimide layer comprises 50 mol% or more 3,3',4,4'-biphenyl tetracarboxylic dianhydride of the total tetracarboxylic dianhydride component, and comprises more than 50 mol% 2,2-bis[4-(4-aminophenoxy) phenyl] propane of the total diamine; and the heat-resistant polyimide layer comprises 50 mol% or more 3,3',4,4'-biphenyl tetracarboxylic dianhydride of the total tetracarboxylic dianhydride component, the peel strength as measured by the method in JIS C6471 being 0.5 N/mm or more.
(FR) L'invention concerne un film de polyimide thermoadhésif qui offre une excellente résistance à la chaleur et une excellente adhésion à une couche de métal, une méthode de production du film de polyimide thermoadhésif, et un stratifié polyimide/métal utilisant le film de polyimide thermoadhésif. L'invention concerne un film de polyimide thermoadhésif multicouche comprenant une couche de polyimide thermoadhésive et une couche de polyimide résistant à la chaleur superposée en contact avec la couche de polyimide thermoadhésive, le film de polyimide thermoadhésif étant caractérisé en ce que : la couche de polyimide thermoadhésive comprend au moins 50 % molaires de dianhydride 3,3',4,4'-biphényle tétracarboxylique de la totalité des composants dianhydride tétracarboxylique et comprend au moins 50 % molaires de 2,2-bis[4-(4-aminophénoxy) phényl] propane de la totalité des diamines ; et la couche de polyimide résistant à la chaleur comprenant au moins 50 % molaires de dianhydride 3,3',4,4'-biphényle tétracarboxylique de la totalité des composants dianhydride tétracarboxylique, la force de détachement mesurée selon la méthode spécifiée dans JIS C6471 étant supérieure ou égale à 0,5 N/mm.
(JA)  耐熱性に優れ、かつ金属層との接着性に優れた熱融着性ポリイミドフィルム、熱融着性ポリイミドフィルムの製造方法及び熱融着性ポリイミドフィルムを用いたポリイミド金属積層体を提供する。 熱融着性ポリイミド層と、前記熱融着性ポリイミド層に接して積層された耐熱性ポリイミド層とを含む多層の熱融着性ポリイミドフィルムであって、熱融着性ポリイミド層は、全テトラカルボン酸二無水物成分中、3,3',4,4'-ビフェニルテトラカルボン酸二無水物を50モル%以上含み、全ジアミン中、2,2-ビス[4-(4-アミノフェノキシ)フェニル]プロパンを50モル%超含み、耐熱性ポリイミド層は、全テトラカルボン酸二無水物成分中、3,3',4,4'-ビフェニルテトラカルボン酸二無水物を50モル%以上含み、JIS C6471の方法で測定した剥離強度が0.5N/mm以上であることを特徴とする熱融着性ポリイミドフィルム。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)