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1. (WO2013157378) CIRCUIT CONNECTION MATERIAL, AND MANUFACTURING METHOD FOR ASSEMBLY USING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/157378 International Application No.: PCT/JP2013/059950
Publication Date: 24.10.2013 International Filing Date: 01.04.2013
Chapter 2 Demand Filed: 24.01.2014
IPC:
C09J 7/00 (2006.01) ,C09J 9/02 (2006.01) ,C09J 11/06 (2006.01) ,C09J 129/14 (2006.01) ,C09J 201/00 (2006.01) ,H01L 21/60 (2006.01) ,H01R 11/01 (2006.01) ,H05K 3/32 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7
Adhesives in the form of films or foils
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
9
Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02
Electrically-conducting adhesives
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
06
organic
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
129
Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
14
Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201
Adhesives based on unspecified macromolecular compounds
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
11
Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
01
characterised by the form or arrangement of the conductive interconnection between their connecting locations
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
Applicants:
田中 芳人 TANAKA, Yoshito [JP/JP]; JP (US)
相崎 亮太 AIZAKI, Ryota [JP/JP]; JP (US)
デクセリアルズ株式会社 DEXERIALS CORPORATION [JP/JP]; 東京都品川区大崎1丁目11番2号 ゲートシティ大崎イーストタワー8階 Gate City Osaki, East Tower 8F, 1-11-2, Osaki, Shinagawa-ku, Tokyo 1410032, JP (AllExceptUS)
Inventors:
田中 芳人 TANAKA, Yoshito; JP
相崎 亮太 AIZAKI, Ryota; JP
Agent:
小池 晃 KOIKE, Akira; 東京都港区虎ノ門5丁目13番7号 虎ノ門A&K-IPビル Toranomon A&K IP BLDG., 5-13-7, Toranomon, Minato-ku, Tokyo 1050001, JP
Priority Data:
2012-09552219.04.2012JP
Title (EN) CIRCUIT CONNECTION MATERIAL, AND MANUFACTURING METHOD FOR ASSEMBLY USING SAME
(FR) MATIÈRE DE CONNEXION DE CIRCUIT ET PROCÉDÉ DE FABRICATION POUR UN ENSEMBLE L'UTILISANT
(JA) 回路接続材料、及びこれを用いた実装体の製造方法
Abstract:
(EN) Provided are a circuit connection material, which has a superior low temperature curability, and a manufacturing method for an assembly using same. The circuit connection material has a two-layer structure in which a first adhesive layer comprising a polyvinyl acetal resin, a cationic polymerizing resin, a cationic polymerization initiator and conductive particles, and a second adhesive layer comprising a cationic polymerizing resin and a cationic polymerization initiator are laminated. A high conductive particle capture efficiency is thereby obtained even when fixed by applying pressure at a low temperature and low temperature curability is improved.
(FR) L'invention concerne une matière de connexion de circuit, qui a une aptitude supérieure au durcissement à faible température, et un procédé de fabrication pour un ensemble l'utilisant. La matière de connexion de circuit a une structure à deux couches dans laquelle une première couche adhésive comprenant une résine d'acétal polyvinylique, une résine de polymérisation cationique, un amorceur de polymérisation cationique et des particules conductrices, et une seconde couche adhésive comprenant une résine de polymérisation cationique et un amorçeur de polymérisation cationique, sont laminées. Un rendement élevé de capture de particules conductrices est ainsi obtenu même quand il est fixé par application de pression à une faible température et l'aptitude au durcissement à faible température est améliorée.
(JA)  優れた低温硬化性を有する回路接続材料、及びこれを用いた実装体の製造方法を提供する。ポリビニルアセタール樹脂と、カチオン重合性樹脂と、カチオン重合開始剤と、導電性粒子とを含有する第1の接着剤層と、カチオン重合性樹脂と、カチオン重合開始剤とを含有する第2の接着剤層とが積層された2層構造とする。これにより、低温で圧着した場合でも導電性粒子の高い捕捉効率が得られ、低温硬化性が改善される。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)