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1. WO2013157310 - LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME

Publication Number WO/2013/157310
Publication Date 24.10.2013
International Application No. PCT/JP2013/055782
International Filing Date 04.03.2013
IPC
H01L 33/48 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
CPC
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2933/0091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2933Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
0091Scattering means in or on the semiconductor body or semiconductor body package
H01L 33/54
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
54having a particular shape
H01L 33/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
56Materials, e.g. epoxy or silicone resin
Applicants
  • シャープ株式会社 SHARP KABUSHIKI KAISHA [JP]/[JP]
Inventors
  • 駒田 聡 KOMADA Satoshi
  • 井口 勝次 IGUCHI Katsuji
Agents
  • 佐野 静夫 SANO Shizuo
Priority Data
2012-09367917.04.2012JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME
(FR) DISPOSITIF ÉLECTROLUMINESCENT ET SON PROCÉDÉ DE FABRICATION
(JA) 発光装置及びその製造方法
Abstract
(EN)
A light-emitting device (1) is provided with a light-emitting element (2) that emits light, an encapsulating resin (5) that covers the periphery of the light-emitting element (2), and an uneven structure (20) attached to a light extraction surface (5a) of the encapsulating resin (5). The uneven structure (20) includes: a plurality of protruding bodies (21) comprising an oxide or nitride; and a coating agent (22) comprising a polymer formed in a layer on the surface of the light extraction surface (5a) in such a manner as to form recesses relative to the apexes of the protruding bodies (21).
(FR)
L'invention concerne un dispositif électroluminescent (1) doté d'un élément électroluminescent (2) qui émet de la lumière, d'une résine d'encapsulation (5) qui couvre la périphérie de l'élément électroluminescent (2) et d'une structure irrégulière (20) fixée sur une surface d'extraction de lumière (5a) de la résine d'encapsulation (5). La structure irrégulière (20) comprend : une pluralité de corps en saillie (21), qui comprend un oxyde ou un nitrure ; et un agent de revêtement (22), qui comprend un polymère formé en couche sur la surface de la surface d'extraction de lumière (5a) de manière à former des évidements par rapport aux sommets des corps en saillie (21).
(JA)
 発光装置1は、光を照射する発光素子2と、発光素子2の周囲を覆う封止樹脂5と、封止樹脂5の光取り出し面5aに付着させた凹凸構造体20と、を備える。凹凸構造体20は、酸化物若しくは窒化物からなる複数の凸状体21と、光取り出し面5aの表面に凸状体21の頂部に対して凹となるように層状に形成したポリマーからなるコーティング剤22と、を含む。
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