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1. (WO2013156570) SOLDER MATERIAL, METHOD FOR THE PRODUCTION THEREOF, AND USE THEREOF TO JOIN METAL SUBSTRATES WITHOUT PRESSURE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/156570 International Application No.: PCT/EP2013/058105
Publication Date: 24.10.2013 International Filing Date: 18.04.2013
IPC:
B23K 35/30 (2006.01) ,B22F 1/00 (2006.01) ,B22F 3/10 (2006.01) ,B23K 35/34 (2006.01) ,B23K 35/36 (2006.01) ,B23K 35/02 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35
Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22
characterised by the composition or nature of the material
24
Selection of soldering or welding materials proper
30
with the principal constituent melting at less than 1550°C
B PERFORMING OPERATIONS; TRANSPORTING
22
CASTING; POWDER METALLURGY
F
WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
1
Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition
B PERFORMING OPERATIONS; TRANSPORTING
22
CASTING; POWDER METALLURGY
F
WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
3
Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor
10
Sintering only
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35
Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22
characterised by the composition or nature of the material
34
comprising compounds which yield metals when heated
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35
Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22
characterised by the composition or nature of the material
36
Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35
Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
02
characterised by mechanical features, e.g. shape
Applicants: TECHNISCHE UNIVERSITÄT BERLIN[DE/DE]; Straße des 17. Juni 135 10623 Berlin, DE
Inventors: OESTREICHER, Annerose; DE
RÖHRICH, Tobias; DE
Priority Data:
10 2012 206 587.320.04.2012DE
Title (EN) SOLDER MATERIAL, METHOD FOR THE PRODUCTION THEREOF, AND USE THEREOF TO JOIN METAL SUBSTRATES WITHOUT PRESSURE
(FR) BRASURE, SON PROCÉDÉ DE PRODUCTION ET SON UTILISATION POUR L'ASSEMBLAGE SANS PRESSION DE SUBSTRATS MÉTALLIQUES
(DE) LOTMATERIAL, VERFAHREN ZU DESSEN HERSTELLUNG UND SEINE VERWENDUNG ZUM DRUCKLOSEN FÜGEN METALLISCHER SUBSTRATE
Abstract:
(EN) The invention relates to a silver solder paste and to a silver solder paste containing copper, which can be used to join metal or metallized substrates, in particular copper substrates, without pressure at low temperatures. The silver solder according to the invention contains metal-organic silver complex as a precursor, which forms silver nanoparticles only upon being heated and which forms a silver-metal molten phase over a temperature range from 20 to 40 units upon being heated further, which silver-metal molten phase can be used as a process window for joining already starting at 150°C, preferably starting at approximately 200°C.
(FR) La présente invention concerne une pâte de brasure à l'argent et une pâte de brasure à l'argent contenant du cuivre, apte à être utilisée à faibles températures pour l'assemblage sans pression de substrats métalliques ou métallisés, notamment de substrats en cuivre. La brasure à l'argent selon l'invention contient comme précurseur un complexe d'argent organo-métallique qui, au moment seulement du chauffage, forme des nanoparticules d'argent et qui, lors de la poursuite du chauffage, forme une phase fusible argent-métallique dans une plage de températures de 20 à 40 unités, cette phase pouvant être utilisée en tant que fenêtre de processus pour l'assemblage dès 150°C, de préférence dès environ 200°C.
(DE) Die vorliegende Erfindung betrifft eine Silberlot-Paste und eine kupferhaltige Silberlot-Paste, die zum drucklosen Fügen metallischer oder metallisierter Substrate, insbesondere von Kupfersubstraten, bei niedrigen Temperaturen eingesetzt werden kann. Das erfindungsgemäße Silberlot beinhaltet einen metall-organischen Silberkomplex als Precursor, der erst beim Erhitzen Silbernanopartikel bildet und beim weiteren Erhitzen eine Silber-metallisch schmelzflüssige Phase über einen Temperaturbereich von 20 bis 40 Einheiten ausbildet, die als Prozessfenster zum Fügen bereits ab 150°C, vorzugsweise ab etwa 200°C, genutzt werden kann.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)