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1. (WO2013156389) INTEGRATED LOOP STRUCTURE FOR RADIO FREQUENCY IDENTIFICATION
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/156389 International Application No.: PCT/EP2013/057601
Publication Date: 24.10.2013 International Filing Date: 11.04.2013
IPC:
H01Q 1/22 (2006.01) ,G06K 19/077 (2006.01) ,H01Q 7/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
1
Details of, or arrangements associated with, aerials
12
Supports; Mounting means
22
by structural association with other equipment or articles
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
K
RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19
Record carriers for use with machines and with at least a part designed to carry digital markings
06
characterised by the kind of the digital marking, e.g. shape, nature, code
067
Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
07
with integrated circuit chips
077
Constructional details, e.g. mounting of circuits in the carrier
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
7
Loop aerials with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
Applicants: SMARTRAC IP B.V.[NL/NL]; Strawinskylaan 851 NL-1077 XX Amsterdam, NL
Inventors: KOSKELAINEN, Tuomas; FI
Agent: TAMPEREEN PATENTTITOIMISTO OY; Hermiankatu 1 B FI-33720 Tampere, FI
Priority Data:
61/635,32619.04.2012US
Title (EN) INTEGRATED LOOP STRUCTURE FOR RADIO FREQUENCY IDENTIFICATION
(FR) STRUCTURE DE BOUCLE INTÉGRÉE POUR IDENTIFICATION PAR RADIOFRÉQUENCE
Abstract:
(EN) An assembly for a radio frequency (RF) communication circuit comprising an electrically insulating substrate having a first side and a second side. A first electrically conductive structure is arranged on the first side of the substrate, wherein the first electrically conductive structure has the structure of a split loop, wherein the split loop structure comprises a first end and a second end. The RF communication circuit is arranged to be attached to a site for the RF communication circuit between the first end and the second end. The assembly further comprises a second electrically conductive structure arranged on the second side of the substrate. The second electrically conductive structure is arranged with respect to the first electrically conductive structure in such a manner that the site for the RF communication circuit overlaps the second electrically conductive structure in order to increase the capacitance of the assembly for the RF communication circuit.
(FR) L'invention concerne un ensemble pour un circuit de communication par radiofréquence (RF) qui comprend un substrat électriquement isolant ayant un premier côté et un second côté. Une première structure électriquement conductrice est agencée sur le premier côté du substrat, la première structure électriquement conductrice ayant la structure d'une boucle tronquée, la structure de boucle tronquée comprenant une première extrémité et une seconde extrémité. Le circuit de communication RF est agencé pour être fixé sur un site pour le circuit de communication RF, entre la première et la seconde extrémité. L'ensemble comprend en outre une seconde structure électriquement conductrice agencée sur le second côté du substrat. La seconde structure électriquement conductrice est agencée par rapport à la première structure électriquement conductrice, de manière à ce que le site pour le circuit de communication RF chevauche la seconde structure électriquement conductrice, afin d'augmenter la capacité de l'ensemble pour le circuit de communication RF.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)