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1. WO2013156382 - METHOD OF MARKING A CHIP CARD MODULE BY ETCHING

Publication Number WO/2013/156382
Publication Date 24.10.2013
International Application No. PCT/EP2013/057575
International Filing Date 11.04.2013
IPC
G06K 19/077 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
CPC
G06K 19/07743
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
07743External electrical contacts
Applicants
  • LINXENS HOLDING [FR]/[FR]
Inventors
  • DE MAQUILLE, Yannick
  • HOVEMAN, Bertrand
  • DIEU-GOMONT, Séverine
  • PROYE, Cyril
Agents
  • REGI, François-Xavier
Priority Data
12/0113817.04.2012FR
Publication Language French (FR)
Filing Language French (FR)
Designated States
Title
(EN) METHOD OF MARKING A CHIP CARD MODULE BY ETCHING
(FR) PROCEDE DE MARQUAGE DE MODULE DE CARTE A PUCE PAR GRAVURE
Abstract
(EN)
The invention concerns a method of marking a face arrangement (10, 20, 30 and 70) of an electronic chip card module comprising the step consisting of etching a metal base layer (30) in a region (36) revealing a marking pattern, the etching being carried out on a partial thickness of the metal base layer (30) and the method comprising a subsequent step consisting of covering the metal base layer (30) with a metal coating layer (70), said metal coating layer covering said etched region (36) revealing a marking pattern.
(FR)
L'invention concerne un procédé de marquage d'un aménagement de face (10,20,30,70) de module électronique de carte à puce comprenant l'étape consistant à graver une couche métallique de base (30) dans une zone (36) révélant un motif de marquage, la gravure étant réalisée sur une épaisseur partielle de la couche métallique de base (30) et le procédé comportant une étape ultérieure consistant à recouvrir la couche métallique de base (30) d'une couche métallique de revêtement (70) laquelle couche métallique de revêtement recouvre ladite zone gravée (36) révélant un motif de marquage.
Also published as
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