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1. (WO2013155749) METHOD AND DEVICE FOR TESTING A SUBSTRATE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2013/155749    International Application No.:    PCT/CN2012/075489
Publication Date: 24.10.2013 International Filing Date: 15.05.2012
IPC:
G02F 1/13 (2006.01), H01L 21/66 (2006.01)
Applicants: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. [CN/CN]; NO.9-2,Tangming Rd, Guangming New District Shenzhen, Guangdong 518132 (CN) (For All Designated States Except US).
CHENG, Wen-da [CN/CN]; (CN) (For US Only)
Inventors: CHENG, Wen-da; (CN)
Agent: CENFO INTELLECTUAL PROPERTY AGENCY; Room 210-212, 2/F, Building "Golden", Design Industrial Park, No.3838, Nanshan Road, Nanshan District (Block 11, Industrial Village of Former Nantou Cheng) Shenzhen, Guangdong 518052 (CN)
Priority Data:
201210118199.9 19.04.2012 CN
Title (EN) METHOD AND DEVICE FOR TESTING A SUBSTRATE
(FR) PROCÉDÉ ET DISPOSITIF PERMETTANT DE TESTER UN SUBSTRAT
(ZH) 基板的检测方法和装置
Abstract: front page image
(EN)A method for testing a substrate, comprising: positioning a substrate (S10); performing optical scanning of the substrate to determine whether the substrate has a defect; if a defect exists, then determining the location of same (S20); obtaining size images of the measurement points of the substrate and transmitting same (S30); calculating the width of lines on the substrate and simultaneously obtaining images of the defect location (S40). The present invention also provides a corresponding device for testing a substrate.
(FR)La présente invention concerne un procédé qui permet de tester un substrat, lequel procédé consiste à positionner un substrat (S10); à effectuer un balayage optique du substrat pour déterminer si le substrat présente un défaut, si un défaut existe, à déterminer ensuite l'emplacement dudit défaut (S20); à obtenir des images dimensionnelles des points de mesure du substrat et à les transmettre (S30); à calculer la largeur des lignes sur le substrat et à obtenir simultanément des images de l'emplacement du défaut (S40). La présente invention concerne également un dispositif correspondant permettant de tester un substrat.
(ZH)一种基板的检测方法,包括:对基板进行定位(S10);对基板进行光学扫描,确定基板是否存在缺陷,若存在缺陷,则确定缺陷位置(S20);获取基板的测量点位的尺寸图片,并传送获取的尺寸图片(S30);计算基板上的线路的宽度,同时获取缺陷位置的缺陷图片(S40)。本发明还提供了相应的基板的检测装置。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)