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1. (WO2013155565) SINGLE-CHIP MULTI-DOMAIN GALVANIC ISOLATION DEVICE AND METHOD

Pub. No.:    WO/2013/155565    International Application No.:    PCT/AU2013/000403
Publication Date: Fri Oct 25 01:59:59 CEST 2013 International Filing Date: Thu Apr 18 01:59:59 CEST 2013
IPC: H03M 1/02
H01L 27/00
H04B 1/40
B82Y 25/00
Applicants: THE SILANNA GROUP PTY LTD
Inventors: MOGHE, Yashodhan, Vijay
TERRY, Andrew
Title: SINGLE-CHIP MULTI-DOMAIN GALVANIC ISOLATION DEVICE AND METHOD
Abstract:
An integrated circuit, including: at least three integrated circuit portions mutually spaced on a single electrically insulating die, the integrated circuit portions being mutually galvanically isolated; and signal coupling structures on the die to allow communication of signals between the integrated circuit portions while maintaining the galvanic isolation therebetween.