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1. (WO2013155263) SMALL FORM FACTOR TRANSCEIVER COMPATIBLE WITH SOLDER PROCESSING

Pub. No.:    WO/2013/155263    International Application No.:    PCT/US2013/036115
Publication Date: Fri Oct 18 01:59:59 CEST 2013 International Filing Date: Fri Apr 12 01:59:59 CEST 2013
IPC: B29D 11/00
Applicants: ULTRA COMMUNICATIONS, INC.
Inventors: POMMER, Richard J.
AHADIAN, Joseph F.
KUZNIA, Charles B.
HAGAN, Richard T.
Title: SMALL FORM FACTOR TRANSCEIVER COMPATIBLE WITH SOLDER PROCESSING
Abstract:
A fiber optic transceiver that is compatible with packaging into standard semiconductor packages and for SMT packaging, using materials and fabrication procedures that withstand solder assembly processes. The SMT package can have electrical contacts on the exterior of the package for creating electrical conduits to a substrate, such as a PCB, interposer, or circuit card within a larger assembly. The fiber optic transceiver can be of a non-SMT package configuration, being formed with electrical connection technology that allows direct connection to a substrate with electrical wiring, such as a PCB, interposer, or circuit card within a larger assembly. The fiber optic transceiver may have solderballs, metal posts or other electrical conduit technology that allows direct electrical connection to the substrate.