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1. (WO2013154216) LED LIGHTING MODULE AND LIGHTING DEVICE USING SAID MODULE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/154216 International Application No.: PCT/KR2012/002783
Publication Date: 17.10.2013 International Filing Date: 13.04.2012
IPC:
F21V 17/12 (2006.01) ,F21V 29/00 (2006.01)
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21
LIGHTING
V
FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
17
Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
10
characterised by specific fastening means or way of fastening
12
by screwing
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21
LIGHTING
V
FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
29
Cooling or heating arrangements
Applicants:
김덕용 KIM, Duk Yong [KR/KR]; KR (UsOnly)
주식회사 케이엠더블유 KMW INC. [KR/KR]; 경기도 화성시 동탄면 영천로 183-6 183-6, Yeongcheon-ro Dongtan-myeon, Hwaseong-si Gyeonggi-do 445-813, KR (AllExceptUS)
Inventors:
김덕용 KIM, Duk Yong; KR
Agent:
이건주 LEE, Keon-Joo; 서울시 종로구 대학로9길 16 미화빌딩 Mihwa Bldg. 16, Daehak-ro 9-gil Chongro-gu Seoul 110-524, KR
Priority Data:
Title (EN) LED LIGHTING MODULE AND LIGHTING DEVICE USING SAID MODULE
(FR) MODULE D'ÉCLAIRAGE À LED ET DISPOSITIF D'ÉCLAIRAGE UTILISANT LEDIT MODULE
(KO) 엘이디 발광모듈과 그 모듈을 이용한 조명장치
Abstract:
(EN) The present invention relates to an LED lighting module and to a lighting device using said module. The LED lighting module comprises: a body frame, the base of which has an accommodation groove; a substrate fixed at an inner installation surface of the accommodation groove of the body frame and having multiple LED packages mounted thereon; multiple heat-dissipating fins arranged on an upper surface and a side surface of the body frame and spaced apart from each other; and a fixing unit protruding from the upper surface of the body frame and having a base surface with a coupling hole for coupling the substrate by means of a bolt. The LED lighting module of the present invention is provided with the protruding fixing unit having an inner surface with the coupling hole for fixing the substrate to the body frame by means of a bolt, and therefore, the overall thickness of the body frame is reduced in order to reduce the weight of the module and improve heat-dissipating characteristics of the module.
(FR) La présente invention concerne un module d'éclairage à LED et un dispositif d'éclairage utilisant ledit module. Le module d'éclairage à LED comprend : un châssis corps dont la base comprend une gorge de logement; un substrat fixé au niveau d'une surface d'installation intérieure de la gorge de logement du châssis corps et comportant plusieurs boîtiers de LED montés dessus; plusieurs ailettes de dissipation de chaleur agencées sur une surface supérieure et une surface latérale du châssis corps et espacées les unes des autres; et une unité de fixation dépassant de la surface supérieure du châssis corps et comportant une surface base avec un trou d'accouplement permettant l'accouplement du substrat à l'aide d'un boulon. Le module d'éclairage à LED de la présente invention est doté d'une unité de fixation en saillie comportant une surface intérieure avec le trou d'accouplement afin de fixer le substrat au châssis corps à l'aide d'un boulon, et donc l'épaisseur totale du châssis corps est réduite afin de réduire le poids du module et améliorer les caractéristiques de dissipation de chaleur du module.
(KO) 본 발명은 엘이디 발광모듈 및 그 발광모듈을 이용한 조명장치에 관한 것으로, 저면부에 수용홈이 형성되는 바디프레임과, 상기 바디프레임의 수용홈 내측 설치면에 고정되며, 다수의 엘이디 패키지가 실장된 기판과, 상기 바디프레임의 상면과 측면에 마련되며, 상호 이격되는 다수의 방열핀과, 상기 바디프레임의 상면측으로 돌출되어 상기 기판을 볼트 체결할 수 있는 체결홀이 저면부에 마련된 고정부를 포함한다. 본 발명은 바디프레임에 기판을 볼트로 고정하기 위하여 체결홀이 내측에 마련된 돌출형 고정부를 두어 바디프레임의 전체적인 두께를 감소시켜, 경량화와 방열특성을 항상시킬 수 있는 효과가 있다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)