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1. (WO2013153674) SOLDERING DEVICE AND METHOD, AND MANUFACTURED SUBSTRATE AND ELECTRONIC COMPONENT

Pub. No.:    WO/2013/153674    International Application No.:    PCT/JP2012/060191
Publication Date: Fri Oct 18 01:59:59 CEST 2013 International Filing Date: Sun Apr 15 01:59:59 CEST 2012
IPC: B23K 1/018
B23K 1/08
B23K 1/20
B23K 35/26
H05K 3/34
Applicants: TANIGUROGUMI CORPORATION
株式会社谷黒組
TANIGURO, Katsumori
谷黒 克守
Inventors: TANIGURO, Katsumori
谷黒 克守
Title: SOLDERING DEVICE AND METHOD, AND MANUFACTURED SUBSTRATE AND ELECTRONIC COMPONENT
Abstract:
Highly reliable soldering is performed at low cost and high yield by a soldering device provided with at least: a first organic-fatty-acid-containing solution tank (21) for dipping a treated member (10) having a copper electrode into an organic-fatty-acid-containing solution (31a); a space (24) having a vapor atmosphere of an organic-fatty-acid-containing solution (31b) that is the same as or substantially the same as the organic-fatty-acid-containing solution (31a), a spraying means (33) for blowing a jet of molten solder toward the copper electrode provided to the treated member (10), and a spraying means (34) for blowing a liquid onto excess molten solder to remove the excess molten solder being provided in the horizontal direction in the space (24); and a second organic-fatty-acid-containing solution tank (23) for dipping the treated member, from which the excess molten solder has been removed, again in the organic-fatty-acid-containing solution (31c).