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1. WO2013153469 - DESICCANT COMPOSITION FOR MOISTURE-SENSITIVE ELECTRONIC DEVICES

Publication Number WO/2013/153469
Publication Date 17.10.2013
International Application No. PCT/IB2013/052087
International Filing Date 15.03.2013
IPC
C08K 3/22 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
18Oxygen-containing compounds, e.g. metal carbonyls
20Oxides; Hydroxides
22of metals
C08K 3/34 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
34Silicon-containing compounds
C09K 3/32 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
3Materials not provided for elsewhere
32for treating liquid pollutants, e.g. oil, gasoline or fat
CPC
B01D 53/28
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
DSEPARATION
53Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols,
26Drying gases or vapours
28Selection of materials for use as drying agents
C08K 3/22
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
18Oxygen-containing compounds, e.g. metal carbonyls
20Oxides; Hydroxides
22of metals
C08K 3/34
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
34Silicon-containing compounds
Applicants
  • SAES GETTERS S.P.A. [IT]/[IT]
Inventors
  • MACCHI, Giorgio
  • COLOMBO, Alessandra
  • VACCA, Paolo
  • GIANNANTONIO, Roberto
Agents
  • CONCONE, Emanuele
Priority Data
MI2012A00060113.04.2012IT
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) DESICCANT COMPOSITION FOR MOISTURE-SENSITIVE ELECTRONIC DEVICES
(FR) COMPOSITION DE DÉSHYDRATANT POUR DISPOSITIFS ÉLECTRONIQUES SENSIBLES À L'HUMIDITÉ
Abstract
(EN)
A desiccant composition containing a polymeric binder (3) and a dispersion of powders of desiccant materials (1, 2), in which the desiccant powders (1, 2) are dispersed at least in part in the form of micro -aggregates of desiccant particles (2) surrounded by a polymeric encapsulating material (4) having a different composition with respect to the polymeric binder (3).
(FR)
L'invention porte sur une composition de déshydratant contenant un liant polymère (3) et une dispersion de poudres de matériaux déshydratants (1, 2), les poudres de déshydratant (1, 2) étant dispersées au moins en partie sous la forme de microagrégats de particules de déshydratant (2) entourées d'un matériau d'encapsulation polymère (4) ayant une composition différente par rapport au liant polymère (3).
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