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1. WO2013151365 - SUBSTRATE CARRIER DEVICE FOR DOUBLE-SIDED ELECTROPLATING OF SOLAR CELL

Publication Number WO/2013/151365
Publication Date 10.10.2013
International Application No. PCT/KR2013/002830
International Filing Date 05.04.2013
IPC
C25D 17/06 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
17Constructional parts, or assemblies thereof, of cells for electrolytic coating
06Suspending or supporting devices for articles to be coated
C25D 7/12 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
7Electroplating characterised by the article coated
12Semiconductors
CPC
C25D 17/001
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
17Constructional parts, or assemblies thereof, of cells for electrolytic coating
001Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
C25D 17/06
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
17Constructional parts, or assemblies thereof, of cells for electrolytic coating
06Suspending or supporting devices for articles to be coated
C25D 7/126
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
7Electroplating characterised by the article coated
12Semiconductors
123Semiconductors first coated with a seed layer or a conductive layer
126for solar cells
H01L 31/18
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
Applicants
  • 주식회사 호진플라텍 HOJIN PLATECH CO., LTD. [KR]/[KR]
Inventors
  • 김판수 KIM, Pan Soo
  • 이덕행 LEE, Duk Haeng
  • 정운석 JUNG, Woon Suk
Agents
  • 임승섭 LIM, Seung-Seop
Priority Data
10-2012-003549005.04.2012KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) SUBSTRATE CARRIER DEVICE FOR DOUBLE-SIDED ELECTROPLATING OF SOLAR CELL
(FR) DISPOSITIF TRANSPORTEUR DE SUBSTRAT POUR ÉLECTROPLACAGE DOUBLE FACE DE PHOTOPILE
(KO) 태양전지용 양면 전기 도금을 위한 기판 캐리어 장치
Abstract
(EN)
The present invention relates to a substrate carrier device for double-sided electroplating of a solar cell. The substrate carrier device (100) of the present invention comprises: wafer accommodation areas (105) which have apertures and support the rims of wafers to be accommodated through a plurality of first protrusive support portions (140) and a plurality of second protrusive support portions (150) provided on the edges of the wafer accommodation areas; clip mounting rods(106, 107, 108, 109) which are respectively provided on the left sides of the wafer accommodation areas and rotate at fixed positions, and which operate the opening (contact points with wafers are formed) and closing (contact points with wafers are released) of the clips; a plurality of first clips (160) which are provided on the clip mounting rods, and in which the opening and closing of the clips are determined by the rotation of the clip mounting rods; and a plurality of second clips (170) which are provided around the wafer accommodation areas (105) on a second side, and which penetrate holes (151) formed in the second protrusive support portions (150).
(FR)
La présente invention porte sur un dispositif transporteur de substrat pour l'électroplacage double face d'une photopile. Le dispositif (100) transporteur de substrat de la présente invention comprend : des zones (105) de logement de plaquettes qui ont des ouvertures et qui supportent les bords de plaquettes devant être logées grâce à une pluralité de premières parties support faisant saillie (140) et une pluralité de secondes parties support faisant saillie (150) disposées sur les bords des zones de logement de plaquettes ; des tiges de montage de fixation (106, 107, 108, 109) qui sont respectivement disposées sur les côtés gauches des zones de logement de plaquettes et qui tournent à des positions fixes et qui opèrent la fermeture (des points de contact avec les plaquettes sont formés) et l'ouverture (les points de contact avec les plaquettes sont libérés) des fixations ; une pluralité de premières fixations (160) qui sont disposées sur les tiges de montage de fixation, l'ouverture et la fermeture des fixations étant déterminées par la rotation des tiges de montage de fixation ; et une pluralité de secondes fixations (170) qui sont disposées autour des zones de logement de plaquettes (105) sur un second côté et qui pénètrent dans les trous (151) formés dans les secondes parties support faisant saillie (150).
(KO)
본 발명은 태양전지용 양면 전기 도금을 위한 기판 캐리어 장치에 관한 것이다. 본 발명의 기판 캐리어 장치(100)는 개구(opening) 영역의 형태를 가지며 테두리에 설치된 복수의 제 1 돌출 지지부(140)와 복수의 제 2 돌출 지지부(150)를 통해서 수용대상 웨이퍼의 가장자리를 지지하는 웨이퍼 수용영역(105)와, 웨이퍼 수용영역의 좌우 측에 각각 설치되어 고정 위치에서 회전하면서 클립개방(-웨이퍼와 접촉점을 형성) 및 클립닫힘(-웨이퍼와의 접촉점이 해제) 상태를 조작하는 클립장착용 로드(106, 107, 108, 109)와, 클립장착용 로드에 설치되며, 클립장착용 로드의 회전에 의해 클립개방 및 클립닫힘 상태가 결정되는 다수의 제 1 클립(160)과, 제2면에서 웨이퍼 수용영역(105)의 주위에 설치되며, 제 2 돌출 지지부(150)에 형성된 구멍(151)을 관통하는 다수의 제 2 클립(170)을 포함하는 것을 특징으로 한다.
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