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1. WO2013150940 - GLASS SUBSTRATE WITH THROUGH ELECTRODE AND METHOD FOR PRODUCING GLASS SUBSTRATE WITH THROUGH ELECTRODE

Publication Number WO/2013/150940
Publication Date 10.10.2013
International Application No. PCT/JP2013/059051
International Filing Date 27.03.2013
IPC
H01L 23/15 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
14characterised by the material or its electrical properties
15Ceramic or glass substrates
H01L 23/32 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
32Holders for supporting the complete device in operation, i.e. detachable fixtures
H05K 1/11 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
H05K 3/40 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
CPC
H01L 23/15
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
14characterised by the material or its electrical properties
15Ceramic or glass substrates
H01L 23/49827
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
49827Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H05K 1/0306
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
0306Inorganic insulating substrates, e.g. ceramic, glass
H05K 1/115
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
115Via connections; Lands around holes or via connections
H05K 2201/09581
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
095Conductive through-holes or vias
09581Applying an insulating coating on the walls of holes
Applicants
  • 旭硝子株式会社 ASAHI GLASS COMPANY, LIMITED [JP]/[JP]
Inventors
  • 高橋 晋太郎 TAKAHASHI, Shintaro
Agents
  • 伊東 忠重 ITOH, Tadashige
Priority Data
2012-08688805.04.2012JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) GLASS SUBSTRATE WITH THROUGH ELECTRODE AND METHOD FOR PRODUCING GLASS SUBSTRATE WITH THROUGH ELECTRODE
(FR) SUBSTRAT DE VERRE COMPORTANT UNE ÉLECTRODE TRAVERSANTE, ET PROCÉDÉ DE PRODUCTION DE SUBSTRAT DE VERRE COMPORTANT UNE ÉLECTRODE TRAVERSANTE
(JA) 貫通電極付きガラス基板、および貫通電極付きガラス基板の製造方法
Abstract
(EN)
A glass substrate with a through electrode, which comprises: a glass substrate that has first and second surfaces, and a plurality of through holes penetrating from the first surface to the second surface; and a metal layer that is electrically connected from the first surface to the second surface of the glass substrate. This glass substrate with a through electrode is characterized in that: the metal layer has a first portion that is arranged on the lateral surfaces of the through holes; and resin layers are arranged between the first portion and the lateral surfaces of the through holes.
(FR)
La présente invention concerne un substrat de verre comportant une électrode traversante, qui comprend : un substrat de verre, comportant une première et une seconde surface, et une pluralité de trous traversants pénétrant depuis la première surface jusqu'à la seconde surface ; et une couche métallique, qui est connectée électriquement entre la première surface et la seconde surface du substrat de verre. Ce substrat de verre comportant une électrode traversante est caractérisé : en ce que la couche métallique comporte une première partie qui est agencée sur les surfaces latérales des trous traversants ; et en ce que des couches de résine sont agencées entre la première partie et les surfaces latérales des trous traversants.
(JA)
 第1および第2の表面を有し、前記第1の表面から前記第2の表面まで貫通した複数の貫通孔を有するガラス基板と、該ガラス基板の前記第1の表面から前記第2の表面まで電気的に接続された金属層と、を有する貫通電極付きガラス基板であって、前記金属層は、前記貫通孔の側壁側に配置された第1の部分を有し、該第1の部分と前記貫通孔の前記側壁の間には、樹脂層が配置されていることを特徴とする貫通電極付きガラス基板。
Also published as
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