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1. WO2013150690 - PLATED MEMBER, PLATED TERMINAL FOR CONNECTORS, METHOD FOR PRODUCING PLATED MEMBER, AND METHOD FOR PRODUCING PLATED TERMINAL FOR CONNECTORS

Publication Number WO/2013/150690
Publication Date 10.10.2013
International Application No. PCT/JP2012/083055
International Filing Date 20.12.2012
IPC
C25D 7/00 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
7Electroplating characterised by the article coated
B32B 15/01 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products essentially comprising metal
01all layers being exclusively metallic
C25D 5/10 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
10Electroplating with more than one layer of the same or of different metals
C25D 5/50 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
48After-treatment of electroplated surfaces
50by heat-treatment
H01R 13/03 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13Details of coupling devices of the kinds covered by groups H01R12/7087
02Contact members
03characterised by the material, e.g. plating or coating materials
H01R 43/16 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
43Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
16for manufacturing contact members, e.g. by punching and by bending
CPC
B32B 15/01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products comprising ; a layer of; metal
01all layers being exclusively metallic
B32B 15/018
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products comprising ; a layer of; metal
01all layers being exclusively metallic
018one layer being formed of a noble metal or a noble metal alloy
C22C 5/06
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
5Alloys based on noble metals
06Alloys based on silver
C23C 14/16
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
06characterised by the coating material
14Metallic material, boron or silicon
16on metallic substrates or on substrates of boron or silicon
C23C 14/165
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
06characterised by the coating material
14Metallic material, boron or silicon
16on metallic substrates or on substrates of boron or silicon
165by cathodic sputtering
C23C 14/58
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
58After-treatment
Applicants
  • 株式会社オートネットワーク技術研究所 AUTONETWORKS TECHNOLOGIES, LTD. [JP]/[JP]
  • 住友電装株式会社 SUMITOMO WIRING SYSTEMS, LTD. [JP]/[JP]
  • 住友電気工業株式会社 SUMITOMO ELECTRIC INDUSTRIES, LTD. [JP]/[JP]
Inventors
  • 須永 隆弘 SUNAGA, Takahiro
  • 坂 喜文 SAKA, Yoshifumi
  • 齋藤 寧 SAITOU, Yasushi
Agents
  • 上野 登 UENO, Noboru
Priority Data
2012-08695706.04.2012JP
2012-18845729.08.2012JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) PLATED MEMBER, PLATED TERMINAL FOR CONNECTORS, METHOD FOR PRODUCING PLATED MEMBER, AND METHOD FOR PRODUCING PLATED TERMINAL FOR CONNECTORS
(FR) ÉLÉMENT PLAQUÉ, BORNE PLAQUÉE POUR CONNECTEURS, PROCÉDÉ DE PRODUCTION D'ÉLÉMENT PLAQUÉ, ET PROCÉDÉ DE PRODUCTION D'UNE BORNE PLAQUÉE POUR CONNECTEURS
(JA) めっき部材、コネクタ用めっき端子、めっき部材の製造方法、及びコネクタ用めっき端子の製造方法
Abstract
(EN)
To provide, at a low cost, a plated member and a plated terminal for connectors, to each of which a large current can be applied, and each of which has a good balance between low friction coefficient and high heat resistance. To also provide a method for producing the plated member and a method for producing the plated terminal for connectors. Tin plating layers and silver plating layers are alternately laminated on the surface of a base, which is formed of copper or a copper alloy, in such a manner that a silver plating layer forms the outermost surface, and then heating is performed. Consequently, a silver-tin alloy layer that covers the surface of the base and a silver coating layer that covers the silver-tin alloy layer and is exposed as the outermost surface are formed at the same time, thereby obtaining a plated member.
(FR)
La présente invention concerne un élément plaqué et une borne plaquée pour connecteurs, peu coûteux à produire, auxquels un courant élevé peut être appliqué et présentant chacun un bon équilibre entre un faible coefficient de frottement et une résistance thermique élevée. L'invention concerne également un procédé de production de l'élément plaqué et un procédé de production de la borne plaquée pour connecteurs. L'élément plaqué est obtenu par la formation en alternance de couches de placage à base d'étain et de couches de placage à base d'argent sur la surface d'une base, qui est constituée de cuivre ou d'un alliage de cuivre, de telle manière qu'une couche de placage à base d'argent forme la surface la plus externe, puis par la mise en œuvre d'un chauffage. Ainsi, une couche à base d'un alliage d'argent/étain qui recouvre la surface de la base et une couche de revêtement à base d'argent qui recouvre la couche à base d'un alliage d'argent/étain et qui forme la surface la plus externe sont formées en même temps.
(JA)
 大電流を印加することができ、低い摩擦係数と、高い耐熱性とが両立されためっき部材及びコネクタ用めっき端子を低コストで提供すること、及びそのようなめっき部材の製造方法及びコネクタ用めっき端子の製造方法を提供すること。 銅又は銅合金よりなる母材の表面にスズめっき層と銀めっき層とを交互に積層して最表面を銀めっき層とした後に、加熱を行うことで、母材の表面を被覆する銀-スズ合金層と、銀-スズ合金層を被覆し、最表面に露出する銀被覆層とを同時に形成し、めっき部材を得る。
Also published as
DE1120120061896
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