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1. WO2013149006 - REDIRECTION OF ELECTROMAGNETIC SIGNALS USING SUBSTRATE STRUCTURES

Publication Number WO/2013/149006
Publication Date 03.10.2013
International Application No. PCT/US2013/034352
International Filing Date 28.03.2013
IPC
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H01Q 7/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
QANTENNAS, i.e. RADIO AERIALS
7Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
H01Q 1/48 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
QANTENNAS, i.e. RADIO AERIALS
1Details of, or arrangements associated with, antennas
48Earthing means; Earth screens; Counterpoises
H01P 3/12 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
PWAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
3Waveguides; Transmission lines of the waveguide type
12Hollow waveguides
H01P 3/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
PWAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
3Waveguides; Transmission lines of the waveguide type
H01Q 1/24 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
QANTENNAS, i.e. RADIO AERIALS
1Details of, or arrangements associated with, antennas
12Supports; Mounting means
22by structural association with other equipment or articles
24with receiving set
CPC
H01L 2224/32225
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31Structure, shape, material or disposition of the layer connectors after the connecting process
32of an individual layer connector
321Disposition
32151the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
32221the body and the item being stacked
32225the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
H01L 2224/73265
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
732Location after the connecting process
73251on different surfaces
73265Layer and wire connectors
H01L 2924/15311
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
15Details of package parts other than the semiconductor or other solid state devices to be connected
151Die mounting substrate
153Connection portion
1531the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
15311being a ball array, e.g. BGA
H01P 3/006
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
3Waveguides; Transmission lines of the waveguide type
003Coplanar lines
006Conductor backed coplanar waveguides
Applicants
  • KEYSSA, INC. [US]/[US]
Inventors
  • SOVERO, Emilio
  • MCCORMACK, Gary, D.
Agents
  • WALLACE, David, A.
Priority Data
61/616,97028.03.2012US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) REDIRECTION OF ELECTROMAGNETIC SIGNALS USING SUBSTRATE STRUCTURES
(FR) REDIRECTION DE SIGNAUX ÉLECTROMAGNÉTIQUES À L'AIDE DE STRUCTURES DE SUBSTRAT
Abstract
(EN)
A system (150) for transmitting or receiving signals may include a dielectric substrate (154) having a major face (166), a communication circuit (152), and an electromagnetic-energy directing assembly (178). The circuit may include a transducer (156) configured to convert between RF electrical and RF electromagnetic signals and supported in a position spaced from the major face of the substrate operatively coupled to the transducer. The directing assembly may be supported by the substrate in spaced relationship from the transducer and configured to direct EM energy in a region including the transducer and along a line extending away from the transducer and transverse to a plane of the major face.
(FR)
La présente invention porte sur un système pour émettre ou recevoir des signaux, qui peut comprendre un substrat diélectrique ayant une face majeur, un circuit de communication et un ensemble de direction d'énergie électromagnétique. Le circuit peut comprendre un transducteur configuré pour convertir des signaux électromagnétiques radiofréquence (RF) et électriques RF et supporté dans une position espacée de la face majeur du substrat couplé de manière fonctionnelle au transducteur. L'ensemble de direction peut être supporté par le substrat dans une relation espacée du transducteur et configuré pour diriger une énergie électromagnétique (EM) dans une région comprenant le transducteur et le long d'une ligne s'étendant à l'opposé du transducteur et transversale par rapport à un plan de la face majeur.
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