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1. (WO2013148608) METHOD AND APPARATUS FOR DETECTING BURIED DEFECTS

Pub. No.:    WO/2013/148608    International Application No.:    PCT/US2013/033771
Publication Date: Fri Oct 04 01:59:59 CEST 2013 International Filing Date: Wed Mar 27 00:59:59 CET 2013
IPC: H01L 21/66
H01L 21/304
Applicants: KLA-TENCOR CORPORATION
Inventors: XIAO, Hong
JIANG, Ximan
Title: METHOD AND APPARATUS FOR DETECTING BURIED DEFECTS
Abstract:
One embodiment relates to a method of detecting a buried defect in a target microscopic metal feature. An imaging apparatus is configured to impinge charged particles with a landing energy such that the charged particles, on average, reach a depth within the target microscopic metal feature. In addition, the imaging apparatus is configured to filter out secondary electrons and detect backscattered electrons. The imaging apparatus is then operated to collect the backscattered electrons emitted from the target microscopic metal feature due to impingement of the charged particles. A backscattered electron (BSE) image of the target microscopic metal feature is compared with the BSE image of a reference microscopic metal feature to detect and classify the buried defect. Other embodiments, aspects and features are also disclosed.