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1. (WO2013148001) ELECTRICAL ASSEMBLY WITH COMPLIANT PINS FOR HEAT DISSIPATION
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/148001 International Application No.: PCT/US2013/025082
Publication Date: 03.10.2013 International Filing Date: 07.02.2013
IPC:
H01R 12/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
12
Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards (PCBs), flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
Applicants:
DEERE & COMPANY [US/US]; One John Deere Place Moline, IL 61265, US
Inventors:
DUPPONG, Jeffrey, S.; US
Agent:
BARTHOLOMEW, Darin, E.; Deere & Company One John Deere Place Moline, IL 61265, US
Priority Data:
13/432,58228.03.2012US
Title (EN) ELECTRICAL ASSEMBLY WITH COMPLIANT PINS FOR HEAT DISSIPATION
(FR) ENSEMBLE ÉLECTRIQUE À BROCHES CONFORMES POUR LA DISSIPATION THERMIQUE
Abstract:
(EN) An electrical assembly (11) comprises a substrate (49) having a dielectric layer (45) and one or more electrically conductive traces (46, 48) overlying the dielectric layer (45). An electrical component (44) is mounted on a first side (146) of the substrate (49). The electrical component (44) is capable of generating heat. A plurality of conductive through holes (47) in the substrate (49) are located around a perimeter of the electrical component (44). The conductive through holes (47) are connected to a conductive trace (46 or 48) for heat dissipation. A cooling cavity (26) has bores (28) that face a second side of the substrate opposite the first side. A plurality of respective compliant pins (32) are inserted into corresponding conductive through holes (47) and the bores (28), wherein a generally exposed portion of the compliant pin (32) is exposed to air or a coolant liquid within the cooling cavity (26).
(FR) L'ensemble électrique (11) selon l'invention comprend un substrat (49) ayant une couche diélectrique (45) et une ou plusieurs traces électriquement conductrices (46, 48) recouvrant la couche diélectrique (45). Un composant électrique (44) est monté sur un premier côté (146) du substrat (49). Le composant électrique (44) est capable de générer de la chaleur. Une pluralité de trous traversants conducteurs (47) dans le substrat (49) sont situés autour du périmètre du composant électrique (44). Les trous traversants conducteurs (47) sont connectés à une trace conductrice (46 ou 48) pour la dissipation thermique. Une cavité de refroidissement (26) a des perforations (28) qui font face à un second côté du substrat opposé au premier côté. Une pluralité de broches conformes (32) respectives sont insérées dans des trous traversants conducteurs (47) correspondants et les perforations (28), une partie généralement exposée de la broche conforme (32) étant exposée à l'air ou à un liquide de refroidissement dans la cavité de refroidissement (26).
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)