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1. (WO2013147706) MULTI-LAYER SUBSTRATE FOR SEMICONDUCTOR PACKAGING
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2013/147706    International Application No.:    PCT/SG2013/000119
Publication Date: 03.10.2013 International Filing Date: 26.03.2013
IPC:
H01L 23/498 (2006.01), H01L 21/48 (2006.01)
Applicants: ADVANPACK SOLUTIONS PTE LTD [SG/SG]; 21 Kallang Avenue #02-167 Singapore 339412 (SG)
Inventors: LIM, Shoa Siong; (SG).
CHEW, Hwee Seng; (SG)
Agent: PYPRUS PTE LTD; 171 Chin Swee Road #11-01 San Centre Singapore 169877 (SG)
Priority Data:
61/615,399 26.03.2012 US
Title (EN) MULTI-LAYER SUBSTRATE FOR SEMICONDUCTOR PACKAGING
(FR) SUBSTRAT MULTICOUCHE POUR CONDITIONNEMENT SEMI-CONDUCTEUR
Abstract: front page image
(EN)The present invention provides a semiconductor substrate (105, 105a) comprising two or more layers of built-up structural layers (120, 220) formed on a sacrificial carrier (110). Each built-up structural layer, comprising a conductor trace layer (114a,) and an interconnect (118a, 218a), is molded in a resin molding compound. A top surface of the molded compound is abrasively ground and then deposited with an adhesion layer (123, 124, 224). A multi-layer substrate (105, 105a) is then obtained after an outermost conductor trace layer (128a, 228a) is formed on the adhesion layer and the carrier (110) or reinforcing ring (110b) is removed.
(FR)La présente invention concerne un substrat semi-conducteur (105, 105a) comprenant deux couches ou plus de couches structurelles bâties (120, 220) formées sur un support sacrificiel (110). Chaque couche structurelle bâtie, comprenant une couche de traces conductrices (114a) et une interconnexion (118a, 218a), est moulée dans un composé de moulage en résine. Une surface supérieure du composé moulé est meulée par abrasion puis déposée avec une couche d'adhésion (123, 124, 224). Un substrat multicouche (105, 105a) est alors obtenu après qu'une couche de traces conductrices (128a, 228a) a été formée sur la couche d'adhésion et que le support (110) ou anneau de renfort (110b) est retiré.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)