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1. WO2013147442 - COPPER PASTE COMPOSITION FOR PRINTING, AND METHOD OF FORMING METAL PATTERN USING SAME

Publication Number WO/2013/147442
Publication Date 03.10.2013
International Application No. PCT/KR2013/002042
International Filing Date 14.03.2013
IPC
H01B 1/22 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
22the conductive material comprising metals or alloys
H05K 3/40 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
CPC
H01B 1/026
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
02mainly consisting of metals or alloys
026Alloys based on copper
H01B 1/22
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
22the conductive material comprising metals or alloys
H05K 1/095
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
09Use of materials for the ; conductive, e.g. ; metallic pattern
092Dispersed materials, e.g. conductive pastes or inks
095for polymer thick films, i.e. having a permanent organic polymeric binder
Applicants
  • 주식회사 동진쎄미켐 DONGJIN SEMICHEM CO., LTD. [KR]/[KR]
Inventors
  • 이승혁 LEE, Seung-Hyuk
  • 이성현 LEE, Sung-Hyun
  • 유현석 YOO, Hyun-Seok
  • 유관태 YU, Kwan-Tae
  • 한주경 HAN, Ju-Kyung
  • 김성배 KIM, Seong-Bae
Agents
  • 원영호 WON, Young-Ho
Priority Data
10-2012-003232529.03.2012KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) COPPER PASTE COMPOSITION FOR PRINTING, AND METHOD OF FORMING METAL PATTERN USING SAME
(FR) COMPOSITION DE PÂTE DE CUIVRE DESTINÉE À L'IMPRESSION, ET PROCÉDÉ DE FORMATION DE MOTIF MÉTALLIQUE UTILISANT CETTE COMPOSITION
(KO) 인쇄용 구리 페이스트 조성물 및 이를 이용한 금속패턴의 형성방법
Abstract
(EN)
The present invention relates to a copper paste composition for printing, and a method of forming a metal pattern using same. In particular, the copper paste composition for printing according to the present invention can be subjected to both hot air drying and firing and can display favorable electrical conductivity because oxidation does not occur. The method of forming the metal pattern of the present invention employs a simple process of simultaneously drying and firing, so as to be usefully used in forming a metal pattern having favorable electrical conductivity.
(FR)
La présente invention concerne une composition de pâte de cuivre destinée à l'impression ainsi qu'un procédé de formation d'un motif métallique utilisant cette composition. En particulier, la composition de pâte de cuivre destinée à l'impression selon la présente invention peut être assujettie à la fois à un séchage et à une cuisson à l'air chaud, et peut afficher une conductivité électrique favorable du fait qu'il ne se produit pas d'oxydation. Le procédé de formation du motif métallique de la présente invention emploie un simple traitement de séchage et de cuisson simultanés, de façon à être utilisé de manière utile dans la formation d'un motif métallique offrant une conductivité électrique favorable.
(KO)
본 발명은 인쇄용 구리 페이스트 조성물 및 이를 이용한 금속패턴의 형성방법에 관한 것이다. 구체적으로, 본 발명에 따른 인쇄용 구리 페이스트 조성물은 열풍 건조 및 소성이 동시에 가능하면서도 산화가 일어나지 않아 우수한 전기 전도도를 나타낼 수 있으며, 본 발명의 금속패턴의 형성방법은 건조 및 소성을 동시에 실시하는 간단한 공정으로 전기 전도도가 우수한 금속패턴을 형성하는데 유용하게 사용될 수 있다.
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