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1. WO2013147086 - CURABLE RESIN COMPOSITION, METHOD FOR PRODUCING SAME, HIGHLY THERMALLY CONDUCTIVE RESIN COMPOSITION, AND HIGHLY THERMALLY CONDUCTIVE MULTILAYER SUBSTRATE

Publication Number WO/2013/147086
Publication Date 03.10.2013
International Application No. PCT/JP2013/059384
International Filing Date 28.03.2013
IPC
C08L 63/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C08K 3/28 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
28Nitrogen-containing compounds
C08K 5/52 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
49Phosphorus-containing compounds
51Phosphorus bound to oxygen
52bound to oxygen only
H01L 23/12 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
H01L 23/36 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
CPC
C08G 59/08
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
02Polycondensates containing more than one epoxy group per molecule
04of polyhydroxy compounds with epihalohydrins or precursors thereof
06of polyhydric phenols
08from phenol-aldehyde condensates
C08G 59/4042
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; ; e.g. general methods of curing
40characterised by the curing agents used
4007Curing agents not provided for by the groups C08G59/42 - C08G59/66
4014Nitrogen containing compounds
4042Imines; Imides
C08G 59/4284
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; ; e.g. general methods of curing
40characterised by the curing agents used
42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
4284together with other curing agents
C08K 2003/282
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
28Nitrogen-containing compounds
282Binary compounds of nitrogen with aluminium
C08K 3/28
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
28Nitrogen-containing compounds
C08K 5/521
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
49Phosphorus-containing compounds
51Phosphorus bound to oxygen
52Phosphorus bound to oxygen only
521Esters of phosphoric acids, e.g. of H3PO4
Applicants
  • 株式会社トクヤマ TOKUYAMA CORPORATION [JP]/[JP]
Inventors
  • 大野 秀樹 OHNO, Hideki
Agents
  • 山本 典輝 YAMAMOTO, Noriaki
Priority Data
2012-08130030.03.2012JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CURABLE RESIN COMPOSITION, METHOD FOR PRODUCING SAME, HIGHLY THERMALLY CONDUCTIVE RESIN COMPOSITION, AND HIGHLY THERMALLY CONDUCTIVE MULTILAYER SUBSTRATE
(FR) COMPOSITION DE RÉSINE DURCISSABLE, SON PROCÉDÉ DE FABRICATION, COMPOSITION DE RÉSINE À HAUTE CONDUCTIVITÉ THERMIQUE ET SUBSTRAT MULTI-COUCHES À HAUTE CONDUCTIVITÉ THERMIQUE
(JA) 硬化性樹脂組成物及びその製造方法、高熱伝導性樹脂組成物及び高熱伝導性積層基板
Abstract
(EN)
Provided is a curable resin composition which is capable of forming, at low cost, an insulating adhesive layer that has necessary and sufficient bonding strength and high thermal conductivity. A curable resin composition which contains aluminum nitride particles, an epoxy resin, a curing agent and an acidic phosphoric acid ester represented by general formula (1), and wherein the components are mixed with each other. (In formula (1), R1 represents a hydrocarbyl group having 4-20 carbon atoms; R2 represents a saturated hydrocarbylene group having 1-20 carbon atoms; R3 represents a saturated hydrocarbylene group having 2 or 3 carbon atoms; R4 represents a hydrocarbylene group having 1-8 carbon atoms; k represents a number of 0-20; l represents a number of 0-20; m represents a number of 0-20; and n represents a number of 1-2. In cases where there are a plurality of Ri moieties (wherein i is a number of 1-4), the plurality of Ri moieties may be the same as or different from each other; and the order of k-number -COR2O- groups, l-number -R3O- groups and m-number -COR4COO- groups is arbitrary. In cases where n = 2, the two side chains may be the same as or different from each other.)
(FR)
L'invention concerne une composition de résine durcissable qui est apte à former, à bas coût, une couche adhésive isolante qui a une force de liaison nécessaire et suffisante et une haute conductivité thermique. L'invention concerne une composition de résine durcissable qui contient des particules de nitrure d'aluminium, une résine époxy, un agent durcisseur et un ester d'acide phosphorique acide représenté par la formule générale (1), et dans laquelle les composants sont mélangés les uns avec les autres. (Dans la formule (1), R1 représente un groupe hydrocarbyle ayant 4-20 atomes de carbone ; R2 représente un groupe hydrocarbylène saturé ayant 1-20 atomes de carbone ; R3 représente un groupe hydrocarbylène saturé ayant 2 ou 3 atomes de carbone ; R4 représente un groupe hydrocarbylène ayant 1-8 atomes de carbone ; k représente un nombre de 0-20 ; l représente un nombre de 0-20 ; m représente un nombre de 0-20 ; et n représente un nombre de 1-2. Dans les cas où il y a plusieurs fractions Ri (dans lesquelles i est un nombre de 1-4), les différentes fractions Ri peuvent être identiques ou différentes les unes des autres ; et l'ordre des groupes -COR2O- d'indice k, des groupes -R3O- d'indice l et des groupes -COR4COO- d'indice m est arbitraire. Dans les cas où n = 2, les deux chaînes latérales peuvent être identiques ou différentes l'une de l'autre).
(JA)
 必要十分な接合強度を有し、且つ高い熱伝導性を有する絶縁性の接着層を低コストで形成できる、硬化性樹脂組成物を提供する。 窒化アルミニウム粒子、エポキシ樹脂、硬化剤、および、下記一般式(1)で表される酸性リン酸エステルを含有する硬化性樹脂組成物であって、上記各成分が相互に混合されている、硬化性樹脂組成物。(式(1)中、 R:炭素数4~20のヒドロカルビル基 R:炭素数1~20の飽和ヒドロカルビレン基 R:炭素数2~3の飽和ヒドロカルビレン基 R:炭素数1~8のヒドロカルビレン基 k:0~20 l:0~20 m:0~20 n:1~2 であって、 R(i:1~4)が複数ある場合、該複数のRは同一でも異なっていてもよく、 k個の-CORO-基、l個の-RO-基、及びm個の-CORCOO-基がなす順序は任意であり、 n=2の場合、2個の側鎖は同一でも異なっていてもよい。)
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