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1. (WO2013146750) CONDUCTING PATTERN FORMING SUBSTRATE FABRICATION METHOD

Pub. No.:    WO/2013/146750    International Application No.:    PCT/JP2013/058715
Publication Date: Fri Oct 04 01:59:59 CEST 2013 International Filing Date: Wed Mar 27 00:59:59 CET 2013
IPC: H01B 13/00
G09F 9/30
Applicants: ALPS ELECTRIC CO., LTD.
アルプス電気株式会社
Inventors: WATABE, Koya
渡部 弘也
Title: CONDUCTING PATTERN FORMING SUBSTRATE FABRICATION METHOD
Abstract:
[Problem] An objective of the present invention is to provide a conducting pattern forming substrate fabrication method with which a step of peeling photoresist which is immersed in a resist peeling fluid is removed, and a transparent electrode pattern is protected by a protection film. [Solution] A conducting pattern forming substrate fabrication method comprises: a conducting film forming step of forming an organic transparent conducting film (20) upon a substrate (10); an insulation film forming step of forming a transparent insulation film pattern (30) upon at least a portion of the organic transparent conducting film (20); and an inactivation step of, by bringing an exposed region of the organic conducting film (20) whereon the transparent insulation film pattern (30) is not formed into contact with an oxidant and making said region non-conductive, making the portion of the organic transparent conductive film (20) whereon the transparent insulation film pattern (30) is formed into a conductive pattern (transparent electrode pattern (22)).