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|1. (WO2013146700) RESIN COMPOSITION, PREPREG AND LAMINATE|
|Applicants:||MITSUBISHI GAS CHEMICAL COMPANY, INC.
|Title:||RESIN COMPOSITION, PREPREG AND LAMINATE|
Provided are: a resin composition which is capable of easily providing, with good reproducibility, a laminate, a printed wiring board or the like that has not only excellent heat dissipation characteristics but also good moldability, good mechanical drilling processability and excellent appearance; and a prepreg, a metal foil-clad laminate and the like, each of which uses the resin composition. A resin composition which contains (A) a cyanic acid ester compound, (B) an epoxy resin, (C) a first inorganic filler, (D) a second inorganic filler and (E) a molybdenum compound, and wherein the ratio of the average particle diameter of the first inorganic filler (C) to the average particle diameter of the second inorganic filler (D) is from 1:0.02 to 1:0.2.