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1. (WO2013146604) CONDUCTIVE MATERIAL AND CONNECTING STRUCTURE

Pub. No.:    WO/2013/146604    International Application No.:    PCT/JP2013/058346
Publication Date: Fri Oct 04 01:59:59 CEST 2013 International Filing Date: Sat Mar 23 00:59:59 CET 2013
IPC: H01B 1/22
C09J 9/02
C09J 11/04
C09J 201/00
H01B 1/00
H01R 11/01
Applicants: SEKISUI CHEMICAL CO., LTD.
積水化学工業株式会社
Inventors: ISHIZAWA, Hideaki
石澤 英亮
KUBOTA, Takashi
久保田 敬士
Title: CONDUCTIVE MATERIAL AND CONNECTING STRUCTURE
Abstract:
The present invention provides a conductive material capable of reducing the connection resistance in a connecting structure obtained when an electrical connection is established between electrodes to yield the connecting structure. This conductive material contains a binder resin, and conductive particles having solder on a conductive surface. The binder resin includes a curing compound that hardens through heating, and a thermosetting agent. When the binder resin and the solder in the conductive particles are heated at a rate of temperature rise of 10°C/minute and differential scanning calorimetry is performed, an exothermic peak top P1t temperature in the curing of the binder resin is lower than the endothermic peak top P2t temperature in the molten solder.