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1. (WO2013146504) CONDUCTIVE PASTE FOR DIE BONDING, AND DIE BONDING METHOD USING CONDUCTIVE PASTE FOR DIE BONDING
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/146504 International Application No.: PCT/JP2013/057985
Publication Date: 03.10.2013 International Filing Date: 21.03.2013
IPC:
H01L 21/52 (2006.01) ,H01B 1/00 (2006.01) ,H01B 1/22 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
52
Mounting semiconductor bodies in containers
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20
Conductive material dispersed in non-conductive organic material
22
the conductive material comprising metals or alloys
Applicants: TANAKA KIKINZOKU KOGYO K.K.[JP/JP]; 7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1006422, JP
Inventors: OGASHIWA, Toshinori; JP
SHIOYA, Akikazu; JP
MIYAIRI, Masayuki; JP
Agent: TANAKA AND OKAZAKI; Hongo K&K Bldg., 30-10, Hongo 3-chome, Bunkyo-ku, Tokyo 1130033, JP
Priority Data:
2012-07552529.03.2012JP
Title (EN) CONDUCTIVE PASTE FOR DIE BONDING, AND DIE BONDING METHOD USING CONDUCTIVE PASTE FOR DIE BONDING
(FR) PÂTE CONDUCTRICE POUR FIXAGE DE PUCE, ET PROCÉDÉ DE FIXAGE DE PUCE UTILISANT LA PÂTE CONDUCTRICE POUR FIXAGE DE PUCE
(JA) ダイボンド用導電性ペースト及び該導電性ペーストによるダイボンド方法
Abstract:
(EN) The present invention is a conductive paste for die bonding, which is composed of a metal powder and an organic solvent. The metal powder is composed of one or more kinds of metal particles having a purity of 99.9% by mass and an average particle diameter of 0.01-1.0 μm and selected from among a silver powder, a palladium powder and a copper powder, and coating layers that cover at least parts of the metal particles and are formed of gold. The conductive paste of the present invention is capable of suppressing the occurrence of defects such as voids at a bonded portion when a semiconductor element or the like is die-bonded to a substrate.
(FR) La présente invention concerne une pâte conductrice pour fixage de puce, qui est composée d'une poudre métallique et d'un solvant organique. La poudre métallique est composée d'un ou plusieurs types de particules métalliques ayant une pureté de 99,9% en masse et un diamètre de particule moyen de 0,01 à 1,0 μm, et choisie parmi une poudre d'argent, une poudre de palladium et une poudre de cuivre, et des couches de revêtement qui recouvrent au moins des parties des particules métalliques et sont formées d'or. La pâte conductrice de la présente invention est apte à supprimer l'apparition de défauts tels que des vides à une partie fixée lorsqu'un élément semi-conducteur ou analogue est fixé sur à un substrat.
(JA)  本発明は、金属粉末と有機溶剤とからなるダイボンド用の導電性ペーストであって、前記金属粉末は、純度99.9質量%以上、平均粒径0.01μm~1.0μmである銀粉、パラジウム粉、銅粉から選択される一種以上の金属粒子と、前記金属粒子の少なくとも一部を覆う金からなる被覆層と、からなる導電性ペーストである。本発明に係る導電性ペーストによれば、半導体素子等を基板へダイボンドする際に、接合部におけるボイド等の欠陥発生を抑制するができる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)