Search International and National Patent Collections
|1. (WO2013146302) RESIN COMPOSITION, PREPREG, RESIN SHEET, AND METAL FOIL-CLAD LAMINATE|
|Applicants:||MITSUBISHI GAS CHEMICAL COMPANY, INC.
|Title:||RESIN COMPOSITION, PREPREG, RESIN SHEET, AND METAL FOIL-CLAD LAMINATE|
Provided are: a resin composition not only having high flame resistance but also offering an excellent heat resistance, peel strength with copper foil, coefficient of thermal expansion, hygroscopic heat resistance, and electrical properties; a prepreg and single-layer or laminated sheet in which same is used; a metal foil-clad laminate in which the prepreg is used; and the like. This resin composition contains a polyphenylene ether (A) having a number-average molecular weight of 500-5,000, a phosphorus-containing cyanate ester compound (B) represented by formula (13), a cyclophosphazene compound (C), a non-halogen epoxy resin (D), a cyanate ester compound (E) other than the phosphorus-containing cyanate ester compound (B), an oligomer (F) of styrene and/or substituted styrene, and a filler (G), the amount of phosphorus-containing cyanate ester compound (B) contained being 1-10 parts by mass in relation to 100 parts by mass of the total of the (A) to (F) components. In the formula, m represents an integer 1-3.