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1. (WO2013146302) RESIN COMPOSITION, PREPREG, RESIN SHEET, AND METAL FOIL-CLAD LAMINATE

Pub. No.:    WO/2013/146302    International Application No.:    PCT/JP2013/057220
Publication Date: Fri Oct 04 01:59:59 CEST 2013 International Filing Date: Fri Mar 15 00:59:59 CET 2013
IPC: C08L 71/12
B32B 15/08
B32B 27/00
C08J 5/24
C08K 5/5313
C08K 5/5399
C08L 25/04
C08L 63/00
H05K 1/03
Applicants: MITSUBISHI GAS CHEMICAL COMPANY, INC.
三菱瓦斯化学株式会社
Inventors: ITOH, Syouichi
伊藤 祥一
FUKASAWA, Emi
深澤 絵美
UENO, Yoshitaka
上野 至孝
YAGINUMA, Michio
柳沼 道雄
Title: RESIN COMPOSITION, PREPREG, RESIN SHEET, AND METAL FOIL-CLAD LAMINATE
Abstract:
Provided are: a resin composition not only having high flame resistance but also offering an excellent heat resistance, peel strength with copper foil, coefficient of thermal expansion, hygroscopic heat resistance, and electrical properties; a prepreg and single-layer or laminated sheet in which same is used; a metal foil-clad laminate in which the prepreg is used; and the like. This resin composition contains a polyphenylene ether (A) having a number-average molecular weight of 500-5,000, a phosphorus-containing cyanate ester compound (B) represented by formula (13), a cyclophosphazene compound (C), a non-halogen epoxy resin (D), a cyanate ester compound (E) other than the phosphorus-containing cyanate ester compound (B), an oligomer (F) of styrene and/or substituted styrene, and a filler (G), the amount of phosphorus-containing cyanate ester compound (B) contained being 1-10 parts by mass in relation to 100 parts by mass of the total of the (A) to (F) components. In the formula, m represents an integer 1-3.