WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Options
Query Language
Stem
Sort by:
List Length
Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2013146107) PHOTOSENSITIVE CONDUCTIVE PASTE AND METHOD FOR PRODUCING CONDUCTIVE PATTERN
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/146107 International Application No.: PCT/JP2013/055809
Publication Date: 03.10.2013 International Filing Date: 04.03.2013
IPC:
G03F 7/027 (2006.01) ,G03F 7/004 (2006.01) ,G03F 7/40 (2006.01) ,H01B 1/22 (2006.01) ,H01B 13/00 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
26
Processing photosensitive materials; Apparatus therefor
40
Treatment after imagewise removal, e.g. baking
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20
Conductive material dispersed in non-conductive organic material
22
the conductive material comprising metals or alloys
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
13
Apparatus or processes specially adapted for manufacturing conductors or cables
Applicants: TORAY INDUSTRIES, INC.[JP/JP]; 1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo 1038666, JP
Inventors: MIZUGUCHI, Tsukuru; JP
MATSUBA, Satoshi; JP
KUSANO, Kazutaka; JP
Priority Data:
2012-07333828.03.2012JP
Title (EN) PHOTOSENSITIVE CONDUCTIVE PASTE AND METHOD FOR PRODUCING CONDUCTIVE PATTERN
(FR) PÂTE CONDUCTRICE PHOTOSENSIBLE ET PROCÉDÉ DE PRODUCTION D'UNE IMPRESSION CONDUCTRICE
(JA) 感光性導電ペーストおよび導電パターンの製造方法
Abstract:
(EN) The purpose of the present invention is to obtain a photosensitive conductive paste and a method for producing a conductive pattern, each of which is capable of producing a conductive pattern that exhibits strong adhesion to ITO on a substrate and is able to be finely patterned and exhibits electrical conductivity at relatively low temperatures, while having flexibility, if necessary. The present invention provides a photosensitive conductive paste which contains (A) an epoxy acrylate that has an urethane bond, (B) a photopolymerization initiator and (C) a conductive filler.
(FR) La présente invention a pour objet une pâte conductrice photosensible et un procédé de production d'une impression conductrice susceptibles de produire une impression conductrice présentant une forte adhérence à l'ITO sur un substrat. Lesdites pâte et impression conductrices peuvent être finement structurées. De plus, elles présentent une conductibilité électrique à des températures relativement basses et, si nécessaire, une flexibilité. La présente invention concerne une pâte conductrice photosensible contenant (A) un acrylate d'époxy ayant une liaison uréthane, (B) un initiateur de photopolymérisation et (C) un bourrage conducteur.
(JA) 本発明は、基材上のITOとの密着性が強く、微細パターニングが可能で、比較的低温において導電性を発現でき、場合によってはフレキシブル性を有した導電パターンが作製可能な感光性導電ペーストおよび導電パターンの製造方法を得ることを目的とする。本発明は、ウレタン結合を有するエポキシアクリレート(A)、光重合開始剤(B)、および導電フィラー(C)を含む感光性導電ペーストを提供する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)