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1. WO2013145987 - EXPOSURE DRAWING DEVICE, RECORDING MEDIUM IN WHICH PROGRAM IS RECORDED, AND EXPOSURE DRAWING METHOD

Publication Number WO/2013/145987
Publication Date 03.10.2013
International Application No. PCT/JP2013/054580
International Filing Date 22.02.2013
IPC
G03F 7/20 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
H01L 21/027 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
027Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
CPC
G03F 7/2022
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
2022Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
G03F 9/70
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
9Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
70for microlithography
Applicants
  • 株式会社アドテックエンジニアリング ADTEC ENGINEERING CO., LTD. [JP]/[JP]
Inventors
  • 尾崎 幸久 OZAKI, Yukihisa
Agents
  • 中島 淳 NAKAJIMA, Jun
Priority Data
2012-08256230.03.2012JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) EXPOSURE DRAWING DEVICE, RECORDING MEDIUM IN WHICH PROGRAM IS RECORDED, AND EXPOSURE DRAWING METHOD
(FR) DISPOSITIF DE DESSIN D'EXPOSITION, SUPPORT D'ENREGISTREMENT DANS LEQUEL UN PROGRAMME EST ENREGISTRÉ ET PROCÉDÉ DE DESSIN D'EXPOSITION
(JA) 露光描画装置、プログラムを記録した記録媒体、及び露光描画方法
Abstract
(EN)
This exposure drawing method is employed in an exposure drawing device provided with an exposure means that draws a circuit pattern by exposing a substrate to be exposed, which has a first surface and a second surface on the opposite side thereof to the first surface. The method comprises: a mark forming step for forming a first mark that forms a reference for an exposure position and is formed in a predetermined position on the second surface of the substrate to be exposed and for forming a second mark that represents identification information for identifying the substrate to be exposed by relative position by making the relative position thereof with respect to the first mark different for each substrate to be exposed; a first control step for controlling the exposure means such that a circuit pattern is drawn on the first surface of the substrate to be exposed; and a storage step for storing information regarding the first surface exposure in a storage means in correspondence with identification information represented by the relative positions.
(FR)
La présente invention concerne un procédé de dessin d'exposition qui est employé dans un dispositif de dessin d'exposition comportant un moyen d'exposition qui dessine un modèle de circuit par exposition d'un substrat à exposer, qui a une première surface et une seconde surface sur le côté opposé de celui-ci à la première surface. Le procédé comprend : une étape de formation de repère pour former un premier repère qui forme une référence pour une position d'exposition et est formé dans une position prédéterminée sur la seconde surface du substrat à exposer et pour former un second repère qui représente des informations d'identification pour identifier le substrat à exposer par position relative en rendant la position relative de celui-ci par rapport au premier repère différente pour chaque substrat à exposer ; une première étape de commande pour commander le moyen d'exposition de telle sorte qu'un modèle de circuit est dessiné sur la première surface du substrat à exposer ; et une étape de stockage pour stocker des informations concernant l'exposition de la première surface dans un moyen de stockage en correspondance avec des informations d'identification représentées par les positions relatives.
(JA)
 第1面及び該第1面に対向する第2面を有する被露光基板を露光することにより回路パターンを描画する露光手段を備えた露光描画装置における露光描画方法であって、被露光基板の第2面の予め定められた位置に露光位置の基準とする第1マークを形成すると共に、第1マークに対する相対位置を被露光基板毎に異ならせることにより該相対位置によって被露光基板を識別する識別情報を表す第2マークを形成するマーク形成ステップと、被露光基板の第1面に回路パターンが描画されるように露光手段を制御する第1制御ステップと、相対位置によって表される識別情報に対応させて第1面の露光に関する情報を記憶手段に記憶する記憶ステップと、を行う。
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