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1. (WO2013145839) DEFECT DETECTION APPARATUS
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/145839 International Application No.: PCT/JP2013/051964
Publication Date: 03.10.2013 International Filing Date: 30.01.2013
IPC:
G01N 25/72 (2006.01) ,G01B 11/00 (2006.01) ,G01N 21/956 (2006.01) ,G01N 27/20 (2006.01) ,G01R 31/02 (2006.01)
G PHYSICS
01
MEASURING; TESTING
N
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
25
Investigating or analysing materials by the use of thermal means
72
Investigating presence of flaws
G PHYSICS
01
MEASURING; TESTING
B
MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
11
Measuring arrangements characterised by the use of optical means
G PHYSICS
01
MEASURING; TESTING
N
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21
Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible, or ultra-violet light
84
Systems specially adapted for particular applications
88
Investigating the presence of flaws, defects or contamination
95
characterised by the material or shape of the object to be examined
956
Inspecting patterns on the surface of objects
G PHYSICS
01
MEASURING; TESTING
N
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
27
Investigating or analysing materials by the use of electric, electro-chemical, or magnetic means
02
by investigating impedance
04
by investigating resistance
20
Investigating the presence of flaws
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31
Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
02
Testing of electric apparatus, lines, or components for short-circuits, discontinuities, leakage, or incorrect line connection
Applicants: SHARP KABUSHIKI KAISHA[JP/JP]; 22-22, Nagaike-cho, Abeno-ku, Osaka-shi Osaka 5458522, JP
Inventors: UEDA, Yasuhiro; null
SHINOZAKI, Toshiyuki; null
MORITA, Haruyuki; null
KOHKETSU, Hideto; null
NAKAKURA, Yukihiko; null
Agent: YONETSU, Kiyoshi; c/o SHARP KABUSHIKI KAISHA, 22-22, Nagaike-cho, Abeno-ku, Osaka-shi Osaka 5458522, JP
Priority Data:
2012-07478328.03.2012JP
Title (EN) DEFECT DETECTION APPARATUS
(FR) APPAREIL DE DÉTECTION DE DÉFAUT
(JA) 欠陥検出装置
Abstract:
(EN) To suitably detect defects of wiring on a substrate. An infrared camera (4) is attached to the beam section (12c) of a gantry (12), said beam section being disposed across an alignment stage (11) having a mother board (1) placed thereon, such that the relative position with respect to the board surface of the mother board (1) placed on the alignment stage (11) is fixed in the direction perpendicular to the board surface.
(FR) La présente invention vise à détecter de manière appropriée des défauts de câblage sur un substrat. Une caméra infrarouge (4) est fixée à la section de faisceau (12c) d'un portique (12), ladite section de faisceau étant disposée de part et d'autre d'un étage d'alignement (11) ayant une carte mère (1) placée sur celui-ci, de telle sorte que la position relative par rapport à la surface de carte de la carte mère (1) placée sur l'étage d'alignement (11) est fixe dans la direction perpendiculaire à la surface de carte.
(JA) 基板上の配線の欠陥を適切に検出する。 赤外線カメラ4を、マザー基板1が載置されるアライメントステージ11を跨ぐように配置されたガントリー12の梁部12cに、アライメントステージ11上に載置されるマザー基板1の基板面に垂直な方向についての上記基板面に対する相対位置が一定になるように取り付ける。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)