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1. (WO2013145610) METHOD FOR PRODUCING CHIP HAVING WATER-REPELLENT FRONT SURFACE AND HYDROPHILIC BACK SURFACE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/145610 International Application No.: PCT/JP2013/001701
Publication Date: 03.10.2013 International Filing Date: 14.03.2013
IPC:
B32B 27/00 (2006.01) ,H01L 21/52 (2006.01)
Applicants: PANASONIC CORPORATION[JP/JP]; 1006, Oaza Kadoma, Kadoma-shi, Osaka 5718501, JP
Inventors: ARASE, Hidekazu; null
KOMORI, Tomoyuki; null
Agent: SAMEJIMA, Mutsumi; AOYAMA & PARTNERS, Umeda Hankyu Bldg. Office Tower, 8-1, Kakuda-cho, Kita-ku, Osaka-shi, Osaka 5300017, JP
Priority Data:
2012-07319128.03.2012JP
Title (EN) METHOD FOR PRODUCING CHIP HAVING WATER-REPELLENT FRONT SURFACE AND HYDROPHILIC BACK SURFACE
(FR) PROCÉDÉ DE PRODUCTION D'UNE PUCE COMPORTANT UNE SURFACE AVANT HYDROPHOBE ET UNE SURFACE ARRIÈRE HYDROPHILE
(JA) 撥水性表面および親水性裏面を有するチップを製造する方法
Abstract: front page image
(EN) Provided is a novel method for producing a chip having a water-repellent front surface and a hydrophilic back surface. For this purpose, the production method according to the first embodiment of the disclosure of the present invention includes a step of bringing a front surface (811a) of a chip (811) having a hydroxyl group into contact with an organic solution (905), which is obtained by dissolving R1-Si(OR2)3 or R1-SiY3 in a second hydrophobic solvent (905a), while protecting the back surface (811b) of the chip (811) by means of a water film (902), thereby forming a thin water-repellent film on the front surface (811a) of the chip (811).
(FR) L'invention concerne un nouveau procédé de production d'une puce comportant une surface avant hydrophobe et une surface arrière hydrophile. Selon un premier mode de réalisation, le procédé comporte l'étape consistant à mettre la surface avant (811a) d'une puce (811) comportant un groupe hydroxyle en contact avec une solution organique (905), qui est obtenue par la dissolution de R1-Si(OR2)3 ou de R1-SiY3 dans un deuxième solvant hydrophobe (905a), tout en protégeant la surface arrière (811b) de la puce (811) au moyen d'un film d'eau (902), de manière à former un film mince hydrophobe sur la surface avant (811a) de la puce (811).
(JA)  撥水性表面および親水性裏面を有するチップを製造する新規な方法を提供する。そのために、本開示の第1態様に係る製造方法は、水膜902によってチップ811の裏面811bが保護されながら、R-Si(ORまたはR-SiYが第2疎水性溶媒905aに溶解された有機溶液905に、水酸基を有するチップ811の表面811aを接触させて、チップ811の表面811aに撥水性の薄膜を形成する工程を含む。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)