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1. (WO2013145258) COMPOSITE NANOMETAL PASTE CONTAINING COPPER FILLER AND BONDING METHOD

Pub. No.:    WO/2013/145258    International Application No.:    PCT/JP2012/058570
Publication Date: Fri Oct 04 01:59:59 CEST 2013 International Filing Date: Sat Mar 31 01:59:59 CEST 2012
IPC: B22F 1/02
B22F 1/00
B23K 20/00
H01B 1/00
H01B 1/22
H01L 21/52
H05K 1/09
Applicants: Applied Nanoparticle Laboratory Corporation
株式会社応用ナノ粒子研究所
SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
新電元工業株式会社
KOMATSU Teruo
小松 晃雄
MATSUBAYASHI Ryo
松林 良
Inventors: KOMATSU Teruo
小松 晃雄
MATSUBAYASHI Ryo
松林 良
Title: COMPOSITE NANOMETAL PASTE CONTAINING COPPER FILLER AND BONDING METHOD
Abstract:
The present invention addresses the problem of providing a composite nanometal paste which is relatively low in price and is excellent in terms of bonding characteristics, thermal conductivity, and electrical property. The present invention is a copper-filler-containing composite nanometal paste that contains composite nanometal particles each comprising a metal core and an organic coating layer formed thereon. The metal paste contains a copper filler and contains, as binders, first composite nanometal particles and second composite nanometal particles which differ from the first composite nanometal particles in the thermal decomposition temperature of the organic coating layer, wherein the mass proportion W1 of the organic coating layer in the first composite nanometal particles is in the range of 2-13 mass%, the mass proportion W2 of the organic coating layer in the second composite nanometal particles is in the range of 5-25 mass%, and these particles satisfy the relationships W1